LCMXO3D-9400HC-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 1,737 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN5A992CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3D-9400HC-6BG256I – MachXO3D FPGA, 9,400 logic elements, 206 I/Os, 256-LFBGA

The LCMXO3D-9400HC-6BG256I is a MachXO3D family Field Programmable Gate Array (FPGA) offering 9,400 logic elements and extensive on-chip resources in a compact 256-LFBGA package. Its combination of non-volatile reconfigurability, dedicated embedded security IP, and programmable I/O capabilities addresses system control, interface integration, and secure configuration requirements in industrial designs.

Designed for surface-mount assembly and rated for industrial operation, this device provides a wide operating voltage window and a large number of I/Os to simplify board-level integration and reduce external glue logic.

Key Features

  • Logic Capacity — 9,400 logic elements for implementing glue logic, control functions, and custom finite-state machines.
  • Embedded Memory — 442,368 bits of on-chip RAM (approximately 0.44 Mbits) to support FIFOs, buffers, and small state tables.
  • High I/O Count — 206 user I/Os to support broad interface requirements without extensive external components.
  • Dedicated Embedded Security Block (ESB) — On-chip security IP to support secure configuration and device authentication workflows.
  • Flexible I/O and Source-Synchronous Support — Pre‑engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture for robust interfacing.
  • On-Chip Clocking and PLLs — Flexible on-chip clocking resources including PLLs for system timing and clock domain management.
  • Non-volatile, Reconfigurable — Device retains configuration without external volatile configuration memory; supports TransFR reconfiguration mechanisms described in the family datasheet.
  • Hardened Peripheral IP — Embedded hardened IP functions such as I2C, SPI, timers and system utilities to accelerate design integration.
  • Package & Mounting — 256-LFBGA (supplier package 256-CABGA 14×14), surface-mount compatible for compact board layouts.
  • Power and Temperature — Operates from 2.375 V to 3.465 V and rated for industrial temperature range −40 °C to 100 °C.
  • Standards & Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement control state machines, signal conditioning logic, and protocol translation within industrial equipment using the device’s industrial temperature rating and robust I/O count.
  • Interface Bridging and I/O Expansion — Use the 206 I/Os and flexible I/O buffers to consolidate multiple interfaces or expand legacy connectors without adding numerous discrete components.
  • Security and Authentication — Leverage the Dedicated Embedded Security Block to add device-level authentication and secure configuration in systems that require tamper resistance or secure boot-like functions.
  • Embedded Timing and Memory Functions — Employ on-chip PLLs and approximately 0.44 Mbits of embedded RAM for clocking, buffering, and FIFO applications in data acquisition and communication endpoints.

Unique Advantages

  • Highly integrated logic and I/O: 9,400 logic elements paired with 206 I/Os reduce external glue logic and simplify PCB routing.
  • Secure, non-volatile configuration: Built-in non-volatile reconfiguration and an embedded security block help preserve configuration state and support secure device workflows.
  • Compact industrial package: 256-LFBGA (14×14) offers a small footprint while providing a high pin count suitable for space-constrained designs.
  • Broad operating range: 2.375–3.465 V supply range and −40 °C to 100 °C rating enable reliable operation across common industrial environments.
  • Embedded peripherals to accelerate design: Hardened SPI, I2C, timers, PLLs and on-chip oscillator reduce development time and bill-of-materials.

Why Choose LCMXO3D-9400HC-6BG256I?

This MachXO3D device balances significant programmable logic capacity with a large I/O complement, on-chip memory, and dedicated security and peripheral IP—delivering a versatile FPGA choice for industrial and embedded designs that need secure, reconfigurable logic in a compact package. Its voltage flexibility, industrial temperature rating, and RoHS compliance make it suitable for demanding board-level implementations where space, integration, and reliability matter.

Engineers and procurement teams seeking a non-volatile, reconfigurable FPGA with integrated security and I/O density will find the LCMXO3D-9400HC-6BG256I well suited for system glue logic, interface consolidation, and secure embedded control applications.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO3D-9400HC-6BG256I.

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