LCMXO3D-4300ZC-3BG256I

The LCMXO3D-4300ZC-3BG256I is a MachXO3D field programmable gate array (FPGA) IC designed for industrial applications. It combines approximately 4,300 logic elements with on-chip embedded memory and a broad set of system features from the MachXO3D device family to serve glue‑logic, I/O expansion, and system control roles.

With 206 I/Os, dedicated embedded security features, and non-volatile reconfigurable architecture, this device targets designs that require flexible I/O, secure functions, and reliable operation across an industrial temperature range.

Key Features

• Core Logic  Approximately 4,300 logic elements for custom glue logic, control state machines, and finite‑state implementations.
• Embedded Memory  About 94 kbits of on-chip RAM (94,208 total RAM bits) for FIFOs, small buffers, and local data storage.
• I/O Capacity & Flexibility  206 general-purpose I/Os with the MachXO3D family’s pre‑engineered source‑synchronous I/O and high-performance, flexible I/O buffer options.
• Security & Hardened IP  Includes a dedicated Embedded Security Block plus hardened IP functions (examples in the family data sheet) to help implement secure features in system designs.
• Non-volatile, Reconfigurable  MachXO3D non‑volatile reconfiguration and TransFR reconfiguration support allow persistent configurations without external Flash and flexible in-field updates.
• Clocking & On‑chip Oscillator  Flexible on‑chip clocking resources, including PLLs and an internal oscillator, for clock management without adding external clock ICs.
• Package & Mounting  256‑LFBGA surface‑mount package (supplier device package: 256‑CABGA, 14×14), enabling compact board integration.
• Voltage & Temperature Range  Operates from 2.375 V to 3.465 V and is specified for industrial temperature operation from –40 °C to 100 °C.
• System-Level Support  Family features include enhanced system support, advanced packaging options, user flash memory (UFM), and debug/configuration features described in the MachXO3D data sheet.

Typical Applications

• Industrial Control  Used for gateware that interfaces sensors, actuators, and industrial buses where robust I/O count and industrial temperature range are required.
• System Glue Logic  Implement bus bridges, protocol adapters, and peripheral multiplexing to consolidate discrete logic and simplify PCBs.
• Secure Boot / Authentication  Leverage the embedded security block and hardened IP to implement device authentication, secure configuration storage, and basic tamper resistance.
• Interface Expansion  Provide additional GPIO, timing logic, and small buffering functions for communication and control subsystems that need flexible I/O and on‑chip memory.

Unique Advantages

• Highly integrated programmable fabric: Approximately 4,300 logic elements and on‑chip memory reduce the need for external glue logic and discrete RAM in many designs.
• Large I/O count: 206 I/Os enable extensive peripheral and interface connectivity from a single device, simplifying board layout and reducing part count.
• Non‑volatile configuration: Built‑in non‑volatile reconfiguration and TransFR support eliminate dependence on external configuration Flash for persistent boot images.
• Industrial-ready thermal range: Specified for –40 °C to 100 °C operation, supporting deployment in industrial environments.
• Integrated security and hardened IP: On‑device Embedded Security Block and hardened IP functions support secure system features without large external crypto components.
• Compact packaging: 256‑LFBGA (256‑CABGA 14×14) provides a space‑efficient footprint for dense board designs.

Why Choose LCMXO3D-4300ZC-3BG256I?

The LCMXO3D-4300ZC-3BG256I positions itself as a flexible, industrial‑grade FPGA solution for systems that need moderate logic capacity, substantial I/O, on‑chip memory, and integrated system features such as embedded security and non‑volatile configuration. Its combination of approximately 4,300 logic elements, roughly 94 kbits of embedded RAM, and 206 I/Os makes it well suited for designers consolidating glue logic, implementing interface bridges, or adding secure control functions.

Backed by the MachXO3D family architecture and on‑chip system resources, this device offers an approachable path to reduce BOM complexity, support in‑field updates, and maintain operation across an extended temperature range, making it a practical choice for industrial and embedded designs.

Request a quote or contact our sales team to discuss availability, pricing, and how LCMXO3D-4300ZC-3BG256I can fit into your next design.