LCMXO3D-4300ZC-2SG72I

The LCMXO3D-4300ZC-2SG72I is a MachXO3D family field programmable gate array (FPGA) IC from Lattice Semiconductor designed for industrial applications. It combines 4,300 logic elements with on-chip embedded RAM and a dedicated embedded security block, offering a non-volatile, reconfigurable solution for control, interface and system-level functions.

With 58 I/O pins, flexible on-chip clocking, and advanced packaging in a 72‑VFQFN exposed pad (72‑QFN, 10×10) package, this device targets designs that require integration of glue logic, secure configuration, and reliable operation across a wide industrial temperature range.

Key Features

• Core Logic  Approximately 4,300 logic elements (logic element cells) organized across 538 programmable function units (PFU/CLBs) for custom digital logic and glue logic implementation.
• On‑chip Memory  Total embedded RAM of 94,208 bits, supporting RAM, ROM and FIFO modes as described in the MachXO3D family architecture.
• I/O and Interfaces  58 I/O pins with support for pre‑engineered source synchronous I/O and a high‑performance, flexible I/O buffer architecture.
• Security and Hardened IP  Includes a dedicated Embedded Security Block (ESB) and references to hardened I²C and SPI IP cores for secure storage and peripheral interfacing.
• Reconfiguration & Non‑Volatility  Non‑volatile, reconfigurable MachXO3D architecture with TransFR reconfiguration and user flash memory (UFM) options documented for the family.
• Clocking and Timing  Flexible on‑chip clocking features including sysCLOCK PLLs and support for gearbox and synchronous I/O blocks.
• Power and Supply  Operates from a supply range of 2.375 V to 3.465 V with standby and power‑saving modes referenced in the family datasheet.
• Package & Mounting  Surface‑mount 72‑VFQFN exposed pad package (supplier device package: 72‑QFN 10×10) for compact board integration and thermal performance.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and specified as Industrial grade.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the device for control logic, protocol conversion and deterministic glue logic in industrial automation systems that require industrial temperature operation.
• Interface Bridging  Deploy as a compact interface bridge or I/O expander where 58 flexible I/Os and source‑synchronous support simplify board-level signal management.
• Secure Configuration & Authentication  Leverage the Embedded Security Block and on‑device UFM for secure key storage, boot integrity, and configuration protection in embedded systems.
• Embedded System Integration  Embed custom peripherals, timers/counters and SPI/I²C master/slave logic to consolidate discrete components and reduce BOM count.

Unique Advantages

• Integrated Logic and Memory: Combine 4,300 logic elements with 94,208 bits of embedded RAM to implement compact custom logic and data buffering without external memory.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and delivered in a thermally aware 72‑VFQFN exposed pad package suitable for industrial assemblies.
• Secure, Non‑Volatile Reconfiguration: Non‑volatile architecture with embedded security and UFM enables field reconfigurability while protecting configuration data.
• Flexible I/O and Clocking: Source synchronous I/O, flexible on‑chip clocking and gearbox support reduce external circuitry for timing-critical interfaces.
• Compact, Surface‑Mount Package: 72‑QFN (10×10) package provides a high‑density footprint for space‑constrained designs while supporting thermal dissipation via an exposed pad.

Why Choose LCMXO3D-4300ZC-2SG72I?

The LCMXO3D-4300ZC-2SG72I delivers a balanced combination of programmable logic, embedded memory and secure system features in a compact industrial‑grade package. Its non‑volatile reconfiguration, on‑chip security block and flexible I/O make it well suited for designs that require reliable field reprogrammability, interface consolidation and secure configuration storage.

This device is ideal for engineers specifying compact FPGAs for industrial control, interface bridging, and embedded system integration where temperature range, RoHS compliance and a small QFN package are important selection criteria.

Request a quote or submit an RFQ to receive pricing and availability for the LCMXO3D-4300ZC-2SG72I. Our team can provide part-level procurement details and assist with volume inquiries.