LCMXO3D-4300HC-6SG72I
| Part Description |
MachXO3D Field Programmable Gate Array (FPGA) IC 58 94208 4300 72-VFQFN Exposed Pad |
|---|---|
| Quantity | 282 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 72-QFN (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 72-VFQFN Exposed Pad | Number of I/O | 58 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 538 | Number of Logic Elements/Cells | 4300 | ||
| Number of Gates | N/A | ECCN | 5A992C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3D-4300HC-6SG72I – MachXO3D Field Programmable Gate Array (FPGA) IC, 4,300 logic elements, 72‑VFQFN Exposed Pad
The LCMXO3D-4300HC-6SG72I is a MachXO3D family FPGA from Lattice Semiconductor, offering a non-volatile, reconfigurable logic fabric in a compact 72‑VFQFN exposed-pad package. It combines 4,300 logic elements with on-chip embedded memory and programmable I/O to address system glue logic, control and security functions in industrial applications.
This device targets designs that require moderate logic density, flexible I/O, and industrial operating range, with support for a 2.375 V to 3.465 V supply and an operating temperature range from −40 °C to 100 °C.
Key Features
- Core Logic Approximately 4,300 logic elements suitable for moderate-density programmable logic and glue‑logic tasks.
- Embedded Memory Approximately 94,208 bits of on-chip RAM for FIFOs, buffering and small data store requirements.
- I/O and Interface Flexibility 58 user I/Os in a 72‑QFN (10×10) exposed pad package, enabling multiple signal interfaces and board-level integration.
- Non‑volatile, Reconfigurable Architecture MachXO3D family features non‑volatile reconfiguration and TransFR reconfiguration to retain designs without external configuration flash.
- Embedded System Functions Family-level features include a Dedicated Embedded Security Block, hardened SPI and I²C IP cores, on‑chip oscillator, and user flash memory (UFM) for system control and secure storage.
- Clocking and Timing Flexible on-chip clocking including PLLs for system clock generation and source-synchronous I/O support.
- Power and Temperature Wide recommended supply range of 2.375 V to 3.465 V and industrial operating temperature from −40 °C to 100 °C for robust deployment in demanding environments.
- Package and Mounting 72‑VFQFN exposed pad, surface‑mount package (72‑QFN, 10×10) to simplify PCB layout and thermal handling.
- Standards and Testability Series-level support for IEEE 1149.1 boundary-scan and system-level configuration and test features.
Typical Applications
- Industrial control systems Leverages industrial temperature grading and flexible I/O to handle interface translation, control sequencing and small-scale logic functions in industrial equipment.
- Security and access control Built‑in Embedded Security Block and non‑volatile configuration are suitable for secure boot, device authentication and protected configuration storage.
- System glue logic and interface bridging Moderate logic density and 58 I/Os enable protocol bridging, pin multiplexing and custom interface adaptation between subsystems.
- Configuration and system management On‑chip UFM, hardened peripherals and on‑chip oscillator support system supervision, configuration storage and simple housekeeping functions.
Unique Advantages
- Highly integrated solution: Combines 4,300 logic elements and approximately 94,208 bits of embedded RAM in a single non‑volatile FPGA to reduce external components and BOM complexity.
- Industrial‑grade robustness: Rated for −40 °C to 100 °C operation and a broad supply range (2.375 V–3.465 V), supporting reliable operation in demanding environments.
- Flexible I/O in compact package: 58 I/Os in a 72‑QFN (10×10) exposed pad package provide multiple interface options while minimizing board area.
- Security and system support: Dedicated Embedded Security Block, UFM and hardened peripheral IP provide on‑device mechanisms for secure configuration and system management.
- On‑chip clocking and timing: Integrated PLLs and source‑synchronous I/O support simplify timing architectures and reduce external clocking requirements.
Why Choose LCMXO3D-4300HC-6SG72I?
The LCMXO3D-4300HC-6SG72I positions itself as a practical, industrial‑rated FPGA for designs that need moderate logic capacity, embedded memory and flexible I/O in a compact QFN package. Its MachXO3D family features—non‑volatile reconfiguration, embedded security functions and on‑chip system IP—help streamline system architecture and lower component count.
This device is well suited for engineers building industrial control, secure access or system‑integration designs that require reliable operation across a wide temperature and supply range, together with vendor‑backed documentation and family-level features for system-level integration.
Request a quote or submit an inquiry to obtain pricing, lead times and technical support for the LCMXO3D-4300HC-6SG72I.

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