LCMXO3D-4300HC-6SG72I

IC FPGA 58 I/O 72QFN
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 58 94208 4300 72-VFQFN Exposed Pad

Quantity 282 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package72-QFN (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case72-VFQFN Exposed PadNumber of I/O58Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs538Number of Logic Elements/Cells4300
Number of GatesN/AECCN5A992CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3D-4300HC-6SG72I – MachXO3D Field Programmable Gate Array (FPGA) IC, 4,300 logic elements, 72‑VFQFN Exposed Pad

The LCMXO3D-4300HC-6SG72I is a MachXO3D family FPGA from Lattice Semiconductor, offering a non-volatile, reconfigurable logic fabric in a compact 72‑VFQFN exposed-pad package. It combines 4,300 logic elements with on-chip embedded memory and programmable I/O to address system glue logic, control and security functions in industrial applications.

This device targets designs that require moderate logic density, flexible I/O, and industrial operating range, with support for a 2.375 V to 3.465 V supply and an operating temperature range from −40 °C to 100 °C.

Key Features

  • Core Logic  Approximately 4,300 logic elements suitable for moderate-density programmable logic and glue‑logic tasks.
  • Embedded Memory  Approximately 94,208 bits of on-chip RAM for FIFOs, buffering and small data store requirements.
  • I/O and Interface Flexibility  58 user I/Os in a 72‑QFN (10×10) exposed pad package, enabling multiple signal interfaces and board-level integration.
  • Non‑volatile, Reconfigurable Architecture  MachXO3D family features non‑volatile reconfiguration and TransFR reconfiguration to retain designs without external configuration flash.
  • Embedded System Functions  Family-level features include a Dedicated Embedded Security Block, hardened SPI and I²C IP cores, on‑chip oscillator, and user flash memory (UFM) for system control and secure storage.
  • Clocking and Timing  Flexible on-chip clocking including PLLs for system clock generation and source-synchronous I/O support.
  • Power and Temperature  Wide recommended supply range of 2.375 V to 3.465 V and industrial operating temperature from −40 °C to 100 °C for robust deployment in demanding environments.
  • Package and Mounting  72‑VFQFN exposed pad, surface‑mount package (72‑QFN, 10×10) to simplify PCB layout and thermal handling.
  • Standards and Testability  Series-level support for IEEE 1149.1 boundary-scan and system-level configuration and test features.

Typical Applications

  • Industrial control systems  Leverages industrial temperature grading and flexible I/O to handle interface translation, control sequencing and small-scale logic functions in industrial equipment.
  • Security and access control  Built‑in Embedded Security Block and non‑volatile configuration are suitable for secure boot, device authentication and protected configuration storage.
  • System glue logic and interface bridging  Moderate logic density and 58 I/Os enable protocol bridging, pin multiplexing and custom interface adaptation between subsystems.
  • Configuration and system management  On‑chip UFM, hardened peripherals and on‑chip oscillator support system supervision, configuration storage and simple housekeeping functions.

Unique Advantages

  • Highly integrated solution: Combines 4,300 logic elements and approximately 94,208 bits of embedded RAM in a single non‑volatile FPGA to reduce external components and BOM complexity.
  • Industrial‑grade robustness: Rated for −40 °C to 100 °C operation and a broad supply range (2.375 V–3.465 V), supporting reliable operation in demanding environments.
  • Flexible I/O in compact package: 58 I/Os in a 72‑QFN (10×10) exposed pad package provide multiple interface options while minimizing board area.
  • Security and system support: Dedicated Embedded Security Block, UFM and hardened peripheral IP provide on‑device mechanisms for secure configuration and system management.
  • On‑chip clocking and timing: Integrated PLLs and source‑synchronous I/O support simplify timing architectures and reduce external clocking requirements.

Why Choose LCMXO3D-4300HC-6SG72I?

The LCMXO3D-4300HC-6SG72I positions itself as a practical, industrial‑rated FPGA for designs that need moderate logic capacity, embedded memory and flexible I/O in a compact QFN package. Its MachXO3D family features—non‑volatile reconfiguration, embedded security functions and on‑chip system IP—help streamline system architecture and lower component count.

This device is well suited for engineers building industrial control, secure access or system‑integration designs that require reliable operation across a wide temperature and supply range, together with vendor‑backed documentation and family-level features for system-level integration.

Request a quote or submit an inquiry to obtain pricing, lead times and technical support for the LCMXO3D-4300HC-6SG72I.

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