LCMXO3D-4300HC-6BG256C

The LCMXO3D-4300HC-6BG256C is a MachXO3D family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides non-volatile, reconfigurable logic in a compact 256‑LFBGA package with up to 206 user I/Os and a commercial temperature rating.

Designed for embedded system control, interface bridging and secure feature integration, this device combines on-chip memory, dedicated embedded security and hardened peripheral IP to simplify system design while maintaining a small board footprint and broad I/O flexibility.

Key Features

• Logic Capacity  Approximately 4,300 logic elements for implementing glue logic, state machines and custom control functions.
• Embedded Memory  Approximately 94,208 bits of on-chip RAM for data buffering, FIFOs and small memory structures.
• I/O Density  206 programmable I/O pins delivered in a 256‑LFBGA package (256‑CABGA, 14×14), supporting flexible board-level interfacing.
• Supply and Operating Range  Single-supply support across 2.375 V to 3.465 V with a commercial operating temperature range of 0°C to 85°C; surface-mount package.
• Embedded Security and Hardened IP  Includes a dedicated Embedded Security Block (ESB) and hardened IP cores such as SPI, I²C and timer/counter functions as part of the MachXO3D family architecture.
• On‑Chip System Resources  Family features include sysMEM embedded block RAM, on‑chip oscillator, user flash memory (UFM) and sysCLOCK PLLs for flexible clocking and memory configurations.
• System-Level Support  Features in the MachXO3D family include TransFR reconfiguration, pre‑engineered source‑synchronous I/O, IEEE 1149.1 boundary scan testability and hot‑socketing considerations.
• Advanced Packaging  256‑ball LFBGA (14×14) offers a compact form factor for space-constrained applications with surface-mount mounting.
• Standards and Compliance  RoHS compliant in accordance with supplier declarations.

Typical Applications

• Embedded System Control  Use the device for board-level control, sequencers and custom logic where moderate logic density and embedded memory are required.
• Interface Bridging  Implement protocol bridging and I/O aggregation leveraging 206 programmable I/Os and hardened peripheral IP cores.
• Secure Feature Integration  Integrate on-chip security functions and protected keys using the Embedded Security Block for product authentication and secure boot elements.
• Peripheral Offload  Offload timers, SPI/I²C handling and simple state machines to free host processor resources while keeping components consolidated on a single FPGA.

Unique Advantages

• Compact, high‑I/O package: 256‑LFBGA with 206 I/Os delivers substantial interfacing capability in a small board footprint, reducing PCB area.
• Non‑volatile reconfigurability: MachXO3D family architecture offers reconfigurable logic without external configuration memory, simplifying system design and component count.
• Integrated security and hardened IP: Embedded Security Block plus hardened SPI, I²C and timer/counter IP reduce integration effort for secure and deterministic system functions.
• On‑chip memory and clocking: sysMEM block RAM and sysCLOCK PLLs provide flexible memory and clock resources for buffering, FIFO implementations and clock domain management.
• Commercial temperature suitability: Rated for 0°C to 85°C operation for mainstream embedded and consumer applications.
• RoHS compliance: Meets environmental regulatory expectations for lead‑free assembly.

Why Choose LCMXO3D-4300HC-6BG256C?

The LCMXO3D-4300HC-6BG256C positions itself as a compact, feature‑rich FPGA option for designers needing moderate logic density, extensive I/O and integrated system functions without external non‑volatile configuration components. Its combination of approximately 4,300 logic elements, on‑chip memory, embedded security and hardened peripheral IP makes it suited to embedded control, interface bridging and secure feature offload in commercial applications.

For teams seeking a single‑device approach to consolidate glue logic, peripheral handling and basic security, this MachXO3D device provides a balanced mix of integration, flexibility and footprint efficiency aligned with Lattice’s MachXO3D family capabilities.

If you would like pricing or availability information, request a quote or submit an inquiry to receive a formal quotation and technical support for design planning.