LCMXO3D-4300HC-5SG72C

The LCMXO3D-4300HC-5SG72C is a MachXO3D family field‑programmable gate array (FPGA) in a 72‑lead VFQFN exposed‑pad package. It provides 4,300 logic elements, 58 user I/O and on‑chip embedded memory suited for compact, reconfigurable system functions.

Designed for commercial applications, this device combines non‑volatile reconfigurability, dedicated embedded security and flexible I/O and clocking features to address system control, interface and security‑aware glue logic requirements while operating over a 2.375–3.465 V supply range.

Key Features

• Core Logic  4,300 logic elements (cells) to implement control, glue logic and finite state machines in compact designs.
• Embedded Memory  Approximately 0.094 Mbits (94,208 bits) of on‑chip RAM for small FIFOs, buffering and state storage.
• I/O and Clocking  58 user I/O with pre‑engineered source‑synchronous I/O and flexible on‑chip clocking (including PLLs) as described in the MachXO3D family data sheet.
• Dedicated Security and Hardened IP  Includes a dedicated Embedded Security Block and hardened IP functions (for example, SPI and I2C cores and timer/counter functions documented in the family data sheet).
• Non‑volatile, Reconfigurable  MachXO3D family architecture supports non‑volatile, reconfigurable operation and TransFR reconfiguration capability referenced in the datasheet.
• On‑chip Utilities  On‑chip oscillator and user flash memory (UFM) for simple system clocks and configuration/state retention as documented in the family data sheet.
• Power and Supply  Operates from a 2.375 V to 3.465 V supply range to support typical commercial logic rails.
• Package and Mounting  72‑VFQFN exposed pad (72‑QFN 10×10 supplier package) optimized for surface‑mount PCB assembly with thermal pad.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• System Control and Glue Logic  Implement control sequencing, protocol translation and board‑level glue functions using the 4,300 logic elements and flexible I/O.
• Interface Bridging  Use pre‑engineered source‑synchronous I/O and hardened serial interfaces to bridge peripherals and bus domains in compact systems.
• Security‑Aware Designs  Leverage the dedicated Embedded Security Block and on‑chip resources for configuration protection and secure feature enablement described in the family data sheet.
• Compact Embedded Systems  Small 72‑VFQFN package with exposed pad and on‑chip memory/oscillator makes the device suitable for space‑constrained commercial applications requiring reconfigurability.

Unique Advantages

• Highly integrated reconfigurable fabric: Combines 4,300 logic elements with embedded RAM and hardened IP to reduce external components and BOM complexity.
• Non‑volatile configuration: MachXO3D family non‑volatile reconfigurability simplifies boot behavior and removes the need for external volatile configuration memory.
• Security and IP blocks on chip: Dedicated Embedded Security Block and hardened cores (SPI, I2C, timers) enable secure and reliable peripheral control without additional processors.
• Flexible I/O and clocking: Pre‑engineered source‑synchronous I/O and on‑chip PLLs support a range of interface timing requirements while keeping board-level design simple.
• Compact, assembly‑friendly package: 72‑VFQFN exposed pad (10×10) offers a small footprint with thermal pad for improved thermal performance on surface‑mount assemblies.
• Commercial grade and RoHS compliant: Rated 0 °C to 85 °C and RoHS compliant for commercial product lines and regulated manufacturing processes.

Why Choose LCMXO3D-4300HC-5SG72C?

The LCMXO3D-4300HC-5SG72C positions itself as a compact, non‑volatile FPGA option for commercial embedded designs that need reconfigurable logic, built‑in security features and flexible I/O in a small QFN package. Its combination of 4,300 logic elements, embedded memory and hardened IP functions delivers a balanced integration point for system control, interface bridging and security‑aware applications.

Choose this device for designs prioritizing a reduced BOM, reconfigurable system behavior and on‑chip security primitives while operating across a common commercial voltage and temperature range. The MachXO3D family data sheet provides additional architectural and functional details to support design and integration.

Request a quote or submit your requirements to receive pricing and availability for the LCMXO3D-4300HC-5SG72C. Our team can provide technical and purchasing support to help evaluate this MachXO3D device for your design.