LCMXO3D-4300HC-6SG72C

IC FPGA 58 I/O 72QFN
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 58 94208 4300 72-VFQFN Exposed Pad

Quantity 860 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package72-QFN (10x10)GradeCommercialOperating Temperature0°C – 85°C
Package / Case72-VFQFN Exposed PadNumber of I/O58Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs538Number of Logic Elements/Cells4300
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3D-4300HC-6SG72C – MachXO3D FPGA IC, 4.3K Logic Elements, 72‑VFQFN

The LCMXO3D-4300HC-6SG72C is a MachXO3D family field programmable gate array (FPGA) IC from Lattice Semiconductor. It provides a mid-density, non-volatile reconfigurable fabric with on-chip memory and dedicated embedded security and hardened peripheral IP, packaged in a compact 72‑VFQFN exposed pad surface-mount package.

Designed for applications that require flexible I/O, embedded memory and integrated security functions, this commercial‑grade device combines 4,300 logic elements and approximately 94 Kbits of embedded RAM with 58 general-purpose I/Os and a broad single-supply voltage range for system-level integration.

Key Features

  • Logic Fabric  4,300 logic elements (cells) providing mid-density programmable logic for control, glue‑logic and interface functions.
  • Embedded Memory  Approximately 94 Kbits of on-chip RAM (94,208 bits) suitable for FIFOs, buffers and small data storage.
  • I/O Capacity & Flexibility  58 general-purpose I/Os with support for the MachXO3D series’ pre‑engineered source‑synchronous and flexible I/O buffering options described in the family datasheet.
  • Security & Hardened IP  Includes the MachXO3D family’s Dedicated Embedded Security Block and other embedded hardened IP functions (hardened I²C, SPI, timers/counters) for system authentication and secure configuration.
  • Non‑volatile, Reconfigurable  Part of a device family offering non‑volatile, reconfigurable operation and TransFR reconfiguration capability as documented in the MachXO3D family datasheet.
  • Clocking & Timing  Flexible on‑chip clocking architecture including PLL support, enabling system clock management and synchronization features described for the family.
  • Power Supply Range  Operates from 2.375 V to 3.465 V to match a variety of single‑supply designs.
  • Package & Mounting  72‑VFQFN exposed pad (supplier device package: 72‑QFN, 10 × 10 mm) optimized for surface‑mount assembly and compact board layouts.
  • Commercial Grade & Environmental  Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic  Use the 4,300 logic elements and 58 I/Os to implement protocol translation, bus bridging and board-level control functions.
  • Secure Configuration & System Authentication  Leverage the Embedded Security Block and non‑volatile reconfiguration for device authentication and secure boot/configuration flows.
  • On‑board Data Buffering  Employ approximately 94 Kbits of embedded RAM for small FIFOs, buffering and temporary data storage in I/O‑intensive designs.
  • Clock and Timing Management  Implement system clock generation, synchronization and PLL‑based timing functions using the family’s flexible on‑chip clocking resources.

Unique Advantages

  • Highly integrated mid‑density FPGA: 4,300 logic elements and embedded RAM reduce external component count for compact designs.
  • Security‑ready: Dedicated Embedded Security Block and hardened peripheral IP facilitate secure configuration and protected data paths.
  • Flexible I/O and clocking: 58 general‑purpose I/Os plus the family’s source‑synchronous and flexible I/O buffering options simplify interfacing with external peripherals and buses.
  • Compact, manufacturable package: 72‑VFQFN exposed pad in a 10 × 10 mm supplier package supports dense PCB layouts and standard surface‑mount assembly.
  • Wide supply compatibility: 2.375 V to 3.465 V supply range enables integration into a range of single‑supply systems.
  • Compliant and commercial ready: Commercial grade operation (0 °C to 85 °C) and RoHS compliance for mainstream electronics applications.

Why Choose LCMXO3D-4300HC-6SG72C?

As a member of the MachXO3D device family, the LCMXO3D-4300HC-6SG72C delivers a balanced combination of logic density, embedded memory and integrated security and peripheral IP in a compact surface‑mount package. Its mix of 4,300 logic elements, approximately 94 Kbits of RAM and 58 I/Os makes it well suited for mid‑density tasks where on‑chip storage, flexible I/O and secure configuration are priorities.

This commercial‑grade device is designed for engineers who need a reconfigurable, non‑volatile FPGA solution with flexible clocking and hardened IP blocks, while maintaining a small PCB footprint and a broad single‑supply voltage range for system compatibility.

Request a quote or submit an inquiry for LCMXO3D-4300HC-6SG72C to get pricing and availability details tailored to your project requirements.

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