LCMXO3D-4300HC-6SG72C
| Part Description |
MachXO3D Field Programmable Gate Array (FPGA) IC 58 94208 4300 72-VFQFN Exposed Pad |
|---|---|
| Quantity | 860 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 72-QFN (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 72-VFQFN Exposed Pad | Number of I/O | 58 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 538 | Number of Logic Elements/Cells | 4300 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3D-4300HC-6SG72C – MachXO3D FPGA IC, 4.3K Logic Elements, 72‑VFQFN
The LCMXO3D-4300HC-6SG72C is a MachXO3D family field programmable gate array (FPGA) IC from Lattice Semiconductor. It provides a mid-density, non-volatile reconfigurable fabric with on-chip memory and dedicated embedded security and hardened peripheral IP, packaged in a compact 72‑VFQFN exposed pad surface-mount package.
Designed for applications that require flexible I/O, embedded memory and integrated security functions, this commercial‑grade device combines 4,300 logic elements and approximately 94 Kbits of embedded RAM with 58 general-purpose I/Os and a broad single-supply voltage range for system-level integration.
Key Features
- Logic Fabric 4,300 logic elements (cells) providing mid-density programmable logic for control, glue‑logic and interface functions.
- Embedded Memory Approximately 94 Kbits of on-chip RAM (94,208 bits) suitable for FIFOs, buffers and small data storage.
- I/O Capacity & Flexibility 58 general-purpose I/Os with support for the MachXO3D series’ pre‑engineered source‑synchronous and flexible I/O buffering options described in the family datasheet.
- Security & Hardened IP Includes the MachXO3D family’s Dedicated Embedded Security Block and other embedded hardened IP functions (hardened I²C, SPI, timers/counters) for system authentication and secure configuration.
- Non‑volatile, Reconfigurable Part of a device family offering non‑volatile, reconfigurable operation and TransFR reconfiguration capability as documented in the MachXO3D family datasheet.
- Clocking & Timing Flexible on‑chip clocking architecture including PLL support, enabling system clock management and synchronization features described for the family.
- Power Supply Range Operates from 2.375 V to 3.465 V to match a variety of single‑supply designs.
- Package & Mounting 72‑VFQFN exposed pad (supplier device package: 72‑QFN, 10 × 10 mm) optimized for surface‑mount assembly and compact board layouts.
- Commercial Grade & Environmental Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic Use the 4,300 logic elements and 58 I/Os to implement protocol translation, bus bridging and board-level control functions.
- Secure Configuration & System Authentication Leverage the Embedded Security Block and non‑volatile reconfiguration for device authentication and secure boot/configuration flows.
- On‑board Data Buffering Employ approximately 94 Kbits of embedded RAM for small FIFOs, buffering and temporary data storage in I/O‑intensive designs.
- Clock and Timing Management Implement system clock generation, synchronization and PLL‑based timing functions using the family’s flexible on‑chip clocking resources.
Unique Advantages
- Highly integrated mid‑density FPGA: 4,300 logic elements and embedded RAM reduce external component count for compact designs.
- Security‑ready: Dedicated Embedded Security Block and hardened peripheral IP facilitate secure configuration and protected data paths.
- Flexible I/O and clocking: 58 general‑purpose I/Os plus the family’s source‑synchronous and flexible I/O buffering options simplify interfacing with external peripherals and buses.
- Compact, manufacturable package: 72‑VFQFN exposed pad in a 10 × 10 mm supplier package supports dense PCB layouts and standard surface‑mount assembly.
- Wide supply compatibility: 2.375 V to 3.465 V supply range enables integration into a range of single‑supply systems.
- Compliant and commercial ready: Commercial grade operation (0 °C to 85 °C) and RoHS compliance for mainstream electronics applications.
Why Choose LCMXO3D-4300HC-6SG72C?
As a member of the MachXO3D device family, the LCMXO3D-4300HC-6SG72C delivers a balanced combination of logic density, embedded memory and integrated security and peripheral IP in a compact surface‑mount package. Its mix of 4,300 logic elements, approximately 94 Kbits of RAM and 58 I/Os makes it well suited for mid‑density tasks where on‑chip storage, flexible I/O and secure configuration are priorities.
This commercial‑grade device is designed for engineers who need a reconfigurable, non‑volatile FPGA solution with flexible clocking and hardened IP blocks, while maintaining a small PCB footprint and a broad single‑supply voltage range for system compatibility.
Request a quote or submit an inquiry for LCMXO3D-4300HC-6SG72C to get pricing and availability details tailored to your project requirements.