LCMXO3D-4300HC-5BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3D Field Programmable Gate Array (FPGA) IC 206 94208 4300 256-LFBGA

Quantity 713 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs538Number of Logic Elements/Cells4300
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3D-4300HC-5BG256I – MachXO3D FPGA, 4300 Logic Elements, 256-LFBGA

The LCMXO3D-4300HC-5BG256I is a MachXO3D family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a compact, non-volatile, reconfigurable FPGA architecture with dedicated on-chip resources for security, interface management and system control.

With 4,300 logic elements, 206 user I/Os, embedded block RAM and hardened IP blocks, this device targets industrial embedded systems that require flexible I/O, on-chip security and a wide operating temperature range.

Key Features

  • Core Logic 4,300 logic elements (cells) suitable for glue logic, interface bridging and control functions.
  • Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM organized as sysMEM block RAM for data buffering and small lookup tables.
  • I/O Capacity 206 user I/O pins with support for pre‑engineered source‑synchronous I/O and flexible on‑chip I/O buffer configurations described in the device family datasheet.
  • Clocking and Timing Flexible on‑chip clocking with sysCLOCK Phase‑Locked Loops (PLLs) and an on‑chip oscillator to support internal timing and clock distribution.
  • Embedded Hardened IP and Security Includes an Embedded Security Block (ESB) IP core and hardened IP functions such as I²C, SPI and timer/counter cores, plus user flash memory (UFM).
  • Non‑volatile and Reconfigurable MachXO3D family device capabilities include non‑volatile configuration and TransFR reconfiguration methods documented in the datasheet.
  • Power and Package Operates from a 2.375 V to 3.465 V supply, supplied in a 256‑LFBGA package (supplier designation 256‑CABGA, 14 × 14 mm) for surface‑mount applications.
  • Industrial Temperature Grade Rated for industrial operation from −40 °C to 100 °C and RoHS‑compliant for environmental compatibility.

Typical Applications

  • Industrial Control — Use for control logic, I/O aggregation and system management in industrial equipment where industrial temperature range and RoHS compliance are required.
  • Interface Bridging — Implement protocol conversion and source‑synchronous interfaces using the device’s flexible I/O and clocking resources.
  • Security‑Enhanced Systems — Leverage the Embedded Security Block and hardened IP cores for authentication, secure configuration storage and protected system functions.
  • System Glue Logic — Replace multiple discrete components by consolidating timing, buffering and peripheral interfacing into a single reconfigurable device.

Unique Advantages

  • Compact, high‑density logic: 4,300 logic elements enable integration of control and interface logic while preserving PCB space.
  • Broad I/O and interface flexibility: 206 user I/Os and documented source‑synchronous I/O support simplify connecting multiple peripherals and high‑speed interfaces.
  • Integrated security and hardened IP: Built‑in ESB and hardened I²C/SPI/timer IP reduce design effort for secure and deterministic system functions.
  • Non‑volatile reconfiguration: MachXO3D family non‑volatile configuration enables field reprogramming and persistent device behavior without external configuration memory.
  • Industrial reliability: Specified for −40 °C to 100 °C operation and supplied in a 256‑LFBGA surface‑mount package suitable for industrial assemblies.
  • Flexible power range: Wide supply range (2.375 V to 3.465 V) supports designs with varying I/O and core voltage domains.

Why Choose LCMXO3D-4300HC-5BG256I?

The LCMXO3D-4300HC-5BG256I balances reconfigurable logic capacity, on‑chip memory and extensive I/O in a compact industrial package. Its built‑in security block and hardened peripheral IP reduce external component count and speed development for embedded system and industrial applications.

This device is suited to engineers who need a non‑volatile, reconfigurable solution with documented clocking, I/O and memory resources, and who want to leverage Lattice Semiconductor’s MachXO3D family architecture and documentation for efficient system integration.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for the LCMXO3D-4300HC-5BG256I.

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