LCMXO3D-4300ZC-3BG256C

The LCMXO3D-4300ZC-3BG256C is a MachXO3D-series FPGA in a 256-LFBGA package, providing non-volatile, reconfigurable logic for embedded system integration. It combines 4,300 logic elements, approximately 94,208 bits of on-chip RAM, and up to 206 I/O pins to support control, glue-logic, and security-aware functions in commercial-grade designs.

Designed for applications that require flexible I/O, modest embedded memory, and integrated security and system functions, this device targets engineers building compact, configurable solutions where package density and a broad supply range are important.

Key Features

• Logic Capacity — 4,300 logic elements and 538 logic clusters provide reconfigurable fabric for custom logic, state machines, and glue logic implementations.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM (sysMEM) suitable for FIFOs, small buffers, and state storage.
• I/O and Interface Flexibility — Up to 206 programmable I/O pins and a flexible on-chip I/O buffer architecture to support a range of external interfaces and board-level connections.
• Non-volatile, Reconfigurable Architecture — MachXO3D family characteristics include non-volatile configuration and support for field reconfiguration.
• Dedicated Security and Hardened IP — Device family includes an Embedded Security Block (ESB) IP core and hardened peripheral IP such as SPI and timer/counter blocks for secure storage and peripheral handling.
• Clocking and System Support — On-chip clocking resources including PLLs and flexible clock distribution for synchronized, source-synchronous I/O operation.
• Power and Voltage Range — Operates from 2.375 V to 3.465 V, enabling compatibility with a range of system power rails.
• Package and Mounting — 256-LFBGA (supplier package: 256-CABGA 14×14) in a surface-mount form factor for compact PCB designs.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Typical Applications

• Control and Glue Logic — Implements board-level glue, protocol translation, and finite-state control where compact, reconfigurable logic is required.
• Secure Configuration and Authentication — Uses the Embedded Security Block and on-chip non-volatile configuration to support secure boot or configuration integrity functions.
• Peripheral and Interface Management — Manages multiple external interfaces and timing using the device’s flexible I/O and clocking resources.
• Embedded System Integration — Provides on-chip memory and hardened IP to offload simple buffering, timing, and peripheral tasks from the host processor.

Unique Advantages

• Highly integrated, reconfigurable platform: Combines logic, embedded RAM, and hardened IP to reduce external components and simplify BOM.
• Flexible I/O and clocking: Up to 206 I/O pins and on-chip PLLs support diverse interface requirements and synchronized data paths.
• Security-aware features: Built-in Embedded Security Block and hardened peripheral IP help implement secure configuration and peripheral handling without large external subsystems.
• Compact package: 256-LFBGA (14×14 CABGA) surface-mount package enables dense board-level integration in space-constrained designs.
• Broad supply compatibility: Operates across a wide supply range (2.375 V–3.465 V) to accommodate common system power rails.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation for standard commercial deployments.

Why Choose LCMXO3D-4300ZC-3BG256C?

The LCMXO3D-4300ZC-3BG256C delivers a balanced combination of reconfigurable logic capacity, embedded RAM, extensive I/O, and integrated security and system IP in a compact 256-LFBGA package. It is well suited to engineers who need a non-volatile, field-reconfigurable device that consolidates glue logic, interface management, and lightweight buffering while keeping board area and BOM count low.

This device is a practical choice for commercial embedded designs that require moderate logic density, secure configuration options, and flexible I/O in a RoHS-compliant, surface-mount footprint backed by the MachXO3D device family feature set.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for the LCMXO3D-4300ZC-3BG256C. Our team can help match the device to your design requirements and provide procurement information.