LCMXO640C-3T100I

The LCMXO640C-3T100I is a MachXO family FPGA optimized for glue logic, bus bridging, bus interfacing, power-up control and general control logic. It combines non-volatile, instant‑on behavior with an FPGA-style array of logic blocks for flexible, reconfigurable designs.

Key architectural highlights include 80 logic blocks (640 logic elements), support for wide I/O voltage ranges, single‑chip non‑volatile configuration and industrial temperature operation, making it suitable for embedded control and interface functions in industrial systems.

Key Features

• Logic Capacity — 80 logic blocks providing 640 logic elements suitable for glue logic, protocol bridging and control tasks.
• I/O — 74 general-purpose I/O pins in the 100‑pin package to support multiple peripheral and bus interfaces.
• Non‑volatile, Instant‑On — Single‑chip non‑volatile configuration delivers microsecond power‑up and eliminates the need for external configuration memory.
• Reconfiguration — Supports in‑field reconfiguration and SRAM-based logic updates; non‑volatile memory can be programmed through JTAG with background programming capability.
• Embedded and Distributed Memory — Family architecture provides distributed RAM; the LCMXO640 family devices include approximately 6.1 Kbits of distributed RAM (no embedded block SRAM).
• Flexible I/O Standards — Family supports multiple I/O standards across permitted voltage rails (examples in family data include LVCMOS at 3.3/2.5/1.8/1.5/1.2 V, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS).
• Power and Sleep Modes — Device supports low static current sleep mode for reduced standby power.
• Voltage and Temperature — Operates from 1.71 V to 3.465 V and is specified for industrial operation from −40 °C to 100 °C.
• Package and Mounting — Surface‑mount 100‑LQFP package; supplier package indicated as 100‑TQFP (14×14 mm).
• Regulatory — RoHS compliant.

Typical Applications

• Glue Logic and System Control — Implement startup sequencing, reset control and board-level control state machines with instant‑on non‑volatile configuration.
• Bus Bridging and Protocol Conversion — Use available I/O count to bridge between buses or translate signals between different voltage domains and standards.
• Power‑Up and Reset Management — Single‑chip configuration enables reliable power‑on behavior and eliminates external configuration memory in power sequencing designs.
• Interface and Peripheral Control — Manage sensor interfaces, LED/keypad control, or peripheral multiplexing where modest logic density and multiple I/Os are required.

Unique Advantages

• Single‑Chip, Instant‑On Configuration: Eliminates external configuration memory and provides microsecond power‑up, simplifying BOM and boot sequencing.
• Reconfigurable In‑Field Updates: JTAG‑programmable non‑volatile memory and background programming enable field updates without hardware replacement.
• Compact Surface‑Mount Package: 100‑LQFP (100‑TQFP, 14×14 mm footprint) balances pin count and board area for densely populated PCBs.
• Industrial Temperature Range: Specified for −40 °C to 100 °C, supporting industrial embedded systems and controls.
• Flexible I/O and Voltage Support: Wide supply range (1.71–3.465 V) and family I/O support enable interfacing across multiple logic families and bus standards.
• RoHS Compliant: Meets lead‑free manufacturing requirements for modern assembly processes.

Why Choose LCMXO640C-3T100I?

The LCMXO640C-3T100I positions itself as a compact, industrial‑grade MachXO FPGA designed for control and interface applications that require non‑volatile instant‑on behavior and modest logic density. Its 640 logic elements, 74 I/Os and flexible supply range make it well suited to replace discrete glue logic and simplify board-level design.

Supported by the MachXO family design flow and in‑field programming capabilities, this device provides a low‑component-count solution for engineers building industrial controllers, interface modules and power sequencing logic, offering long-term design scalability and maintainability.

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