LFCPNX-50-9BFG484I
| Part Description |
CertusPro™-NX Field Programmable Gate Array (FPGA) IC 273 1769472 52000 484-BBGA |
|---|---|
| Quantity | 94 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 273 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13000 | Number of Logic Elements/Cells | 52000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of LFCPNX-50-9BFG484I – CertusPro™-NX Field Programmable Gate Array (FPGA) IC 273 1769472 52000 484-BBGA
The LFCPNX-50-9BFG484I is a CertusPro™-NX field programmable gate array (FPGA) in a 484-ball BGA package, designed for programmable logic implementations in industrial environments. It combines substantial on-chip logic and embedded memory with a high pin count and an industrial operating temperature range to support compact, reliable designs that require reconfigurable hardware resources.
Key Features
- Logic Resources Approximately 52,000 logic elements organized across 13,000 logic blocks, providing a large fabric for custom logic implementation.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 total RAM bits) for buffering, state storage, and data processing tasks.
- High I/O Density Up to 273 I/O pins to support multiple parallel interfaces and external peripherals within a single device.
- Power Supply Core voltage supply range of 950 mV to 1.05 V to match system power domains and enable stable operation within specified limits.
- Industrial Grade and Temperature Range Rated for industrial operation with an operating temperature range of −40 °C to 100 °C for use in harsher environments.
- Package and Mounting 484-ball BGA package (supplier device package: 484-FPBGA, 23 × 23) with surface-mount mounting type for compact board-level integration.
- Regulatory RoHS compliant, meeting common environmental restriction requirements for lead-free assembly.
Typical Applications
- Industrial Control Programmable logic implementations in industrial equipment where an industrial temperature range and reconfigurable hardware are required.
- Embedded Processing Custom data path and control logic for embedded systems leveraging the device's logic density and on-chip RAM.
- High-Density I/O Systems Systems that require many external connections and parallel interfaces, supported by up to 273 I/O pins in a compact BGA footprint.
Unique Advantages
- Significant Logic Capacity: 52,000 logic elements provide capacity for complex, multi-function designs without immediate partitioning across multiple devices.
- On-Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
- High Pin Count in a Compact Package: 273 I/O in a 484-ball BGA (484-FPBGA, 23 × 23) enables dense connectivity while conserving board space.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
- Low-Voltage Core Operation: 950 mV to 1.05 V supply range aligns with modern power architectures for efficient integration.
- RoHS Compliant: Meets common environmental requirements for lead-free assembly and manufacturing.
Why Choose LFCPNX-50-9BFG484I?
The LFCPNX-50-9BFG484I positions itself as a versatile, industrial-grade FPGA offering a balance of logic density, embedded memory, and high I/O count in a compact 484-ball BGA package. It is well suited for engineers and designers implementing reconfigurable logic in industrial equipment, embedded systems, and high-density I/O applications that require robust temperature performance and significant on-chip resources.
Choosing this device provides a path to consolidate logic and memory needs into a single programmable device, simplifying board-level integration while retaining the flexibility to update hardware behavior through reprogramming.
Request a quote or submit your pricing inquiry to get availability and lead-time information for the LFCPNX-50-9BFG484I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016