LFD2NX-17-8MG121I

The LFD2NX-17-8MG121I is a Certus™-NX Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It integrates programmable logic, on-chip RAM, and a set of general-purpose I/O in a compact 121-VFBGA (6×6) package for surface-mount assembly.

Built for industrial applications, the device offers 17,000 logic elements, approximately 0.433 Mbits of embedded memory, and 71 I/O pins, operating from a core voltage range of 950 mV to 1.05 V and across an extended temperature range of −40 °C to 100 °C.

Key Features

• Core and Logic 17,000 logic elements provide the programmable fabric required for custom logic, control functions, and protocol implementation.
• Embedded Memory Approximately 0.433 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Capacity 71 user I/O pins support interfacing to peripherals, sensors, and external logic devices.
• Power and Voltage Core supply range of 0.95 V to 1.05 V to match platform power domains and optimize core performance.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet extended environmental requirements.
• Package and Mounting 121-VFBGA, CSPBGA footprint (supplier device package: 121-CSFBGA, 6×6) designed for surface-mount PCB assembly in compact designs.
• Compliance RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• Embedded and Control Systems — Deploy custom logic and deterministic control using 17,000 logic elements and 71 I/O for machine control, protocol handling, and logic partitioning.
• Industrial Automation — Use the industrial temperature rating (−40 °C to 100 °C) and on-chip memory for sensor interfacing, signal conditioning, and real-time control tasks.
• Communications and I/O Bridging — Implement protocol translation and I/O aggregation leveraging programmable fabric and available I/O count.
• Compact Board Designs — The 121-VFBGA (6×6) package supports space-constrained PCBs where surface-mount assembly and a small footprint are required.

Unique Advantages

• Right-sized Logic Capacity: 17,000 logic elements deliver a balance between integration and board-level complexity for mid-density programmable tasks.
• Integrated On-chip Memory: Approximately 0.433 Mbits of embedded RAM reduces the need for external memory for many control and buffering functions.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in environments with wide thermal variation.
• Compact BGA Package: 121-VFBGA (6×6) package enables high-density placement and compact system designs.
• Low-voltage Core Operation: 0.95 V to 1.05 V core supply supports integration into modern low-voltage power architectures.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for regulatory and environmental compliance.

Why Choose LFD2NX-17-8MG121I?

The LFD2NX-17-8MG121I positions itself as a versatile, industrial-grade FPGA option that combines a substantial logic resource set with embedded RAM and a practical I/O count in a compact BGA footprint. Its voltage and temperature specifications make it suitable for designs that require reliable operation across a range of conditions.

This device is well suited for engineers designing compact, industrial systems that need programmable logic for control, protocol handling, and I/O integration, offering scalability and integration to simplify board-level design and reduce external component count.

Request a quote for the LFD2NX-17-8MG121I to receive pricing and availability details, or submit a quote request to proceed with procurement.