LFE2-12SE-5QN208I

The LFE2-12SE-5QN208I is an FPGA from Lattice Semiconductor’s ECP2 family, offering 12,000 logic elements and on-chip memory resources tailored for embedded and industrial applications. Packaged in a 208-pin BFQFP (28 × 28 mm) with 131 available I/Os, this device targets designs that require moderate logic density, flexible I/O and on-chip memory.

Key operating parameters include a core supply range of 1.14 V to 1.26 V and an industrial operating temperature range of -40 °C to 100 °C. The device is RoHS compliant and supplied in a surface-mount package suitable for production assemblies.

Key Features

• Logic Capacity — 12,000 logic elements for implementing combinational and sequential logic in mid-range system designs.
• Embedded Memory — Total on-chip RAM of 226,304 bits (approximately 0.226 Mbits) to support buffers, LUT-based storage and small embedded data structures.
• sysDSP and DSP Resources — ECP2 family architecture provides dedicated DSP resources (sysDSP blocks) for multiply-accumulate and high-performance signal processing; ECP2-12 family devices include the corresponding sysDSP block support.
• I/O and Interface Flexibility — 131 I/Os available in the 208-BFQFP package; family-level sysI/O supports a wide range of interface standards and source-synchronous operation for clocked interfaces.
• Clocking and Timing — Family-level support for PLLs and DLLs (sysCLOCK) provides clock multiply/divide and phase/delay adjustment for system timing control.
• Package and Mounting — 208-BFQFP (208-PQFP, 28 × 28 mm) surface-mount package optimized for board-level integration.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C for use in industrial environments.
• Configuration and System Support — Family features include SPI boot flash interface, dual-boot image support and on-chip diagnostic/system utilities; design flows are supported by Lattice tools.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Suitable for factory automation, motion control and industrial I/O aggregation where industrial temperature range and flexible I/O are required.
• Embedded Systems — Useful for embedded processing tasks that need on-chip RAM and DSP resources for signal conditioning, protocol handling or glue logic.
• Communications and Networking — Mid-range I/O count and timing resources make the device appropriate for protocol bridging, interface conversion and peripheral conditioning within communication equipment.
• Instrumentation and Test — The combination of logic density, embedded memory and configurable I/O supports data acquisition front-ends, pre-processing and timing-critical measurement systems.

Unique Advantages

• Compact, Mid-Range Logic Integration: 12,000 logic elements provide a balance of capacity and board-level footprint for moderate-complexity designs.
• On-Chip Memory for Local Buffers: 226,304 bits of embedded RAM reduce external memory dependence for control buffers and temporary storage.
• Flexible I/O in a PQFP Package: 131 I/Os in a 208-BFQFP package enable high connectivity without requiring a BGA assembly process.
• Industrial-Grade Operation: Rated to operate from -40 °C to 100 °C, supporting deployments in demanding environmental conditions.
• Family-Level DSP and Clocking Features: ECP2 family DSP blocks and sysCLOCK resources allow efficient implementation of arithmetic-intensive and timing-sensitive logic.
• Proven Design Ecosystem: Supported by Lattice ECP2 family documentation and design tools to accelerate bring-up and development.

Why Choose LFE2-12SE-5QN208I?

The LFE2-12SE-5QN208I delivers a pragmatic mix of logic, embedded memory and I/O in a manufacturable 208-BFQFP package for industrial and embedded systems. Its 12,000 logic elements, approximately 0.226 Mbits of on-chip RAM and 131 I/Os make it well suited for mid-range designs that need local processing, interface flexibility and industrial temperature capability.

As part of the Lattice ECP2 family, this device benefits from family-level DSP, clocking and configuration features and is supported by established design flows—providing scalability and documentation continuity for development teams and long-term product programs.

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