LFE2-12SE-5Q208I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 226304 12000 208-BFQFP |
|---|---|
| Quantity | 22 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-5Q208I – ECP2 Field Programmable Gate Array (FPGA), 12,000 Logic Elements, 131 I/Os
The LFE2-12SE-5Q208I is an industrial-grade ECP2 family FPGA from Lattice Semiconductor Corporation. It delivers 12,000 logic elements, approximately 0.226 Mbits of embedded memory and 131 user I/O pins in a 208-BFQFP surface-mount package.
Designed for applications that require flexible, reconfigurable digital logic and robust board-level integration, this device combines moderate on-chip memory, substantial I/O capacity and a wide operating temperature range for deployment in industrial environments.
Key Features
- Core Logic 12,000 logic elements to implement custom digital functions and moderate-complexity logic designs.
- Embedded Memory Approximately 0.226 Mbits of on-chip RAM for buffering, small LUT-based storage and state machines.
- I/O Capacity 131 user I/Os provide flexible interfacing options for external peripherals and custom bus implementations.
- Power Operates from a core supply range of 1.14 V to 1.26 V to match low-voltage system rails.
- Package & Mounting 208-BFQFP (Supplier device package: 208-PQFP 28×28) in a surface-mount form factor for compact board-level integration.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant, meeting standard lead-free environmental requirements for electronic assemblies.
Typical Applications
- Industrial Automation Implement control logic, custom sequencing and interface bridging in industrial control systems that require industrial-grade temperature performance.
- Embedded Systems Provide configurable logic and I/O expansion for embedded controllers and instrumentation where moderate logic density and on-chip RAM are needed.
- Communication & Interface Bridging Support custom protocol glue logic and multi-I/O interfacing using the device’s 131 user I/Os to connect diverse peripherals and buses.
Unique Advantages
- High Logic Capacity: 12,000 logic elements enable implementation of complex control and glue logic without external ASICs.
- Compact Board-Level Package: 208-BFQFP surface-mount package balances pin count and PCB real estate for space-constrained designs.
- Industrial Temperature Range: −40 °C to 100 °C rating supports reliable operation across a wide range of environmental conditions.
- Low-Voltage Core: 1.14 V to 1.26 V supply range suits low-voltage system architectures and helps reduce power draw at the core.
- Generous I/O: 131 user I/Os allow flexible connectivity for sensors, memory interfaces and peripheral devices.
- RoHS Compliant: Meets lead-free environmental standards for modern electronic manufacturing.
Why Choose LFE2-12SE-5Q208I?
The LFE2-12SE-5Q208I positions itself as a versatile, industrial-grade FPGA solution that combines meaningful logic density, embedded memory and substantial I/O in a compact surface-mount package. It is suited to engineers designing industrial controllers, embedded platforms and interface-rich systems that require reconfigurable logic and reliable temperature performance.
Built by Lattice Semiconductor Corporation and specified for industrial temperatures and RoHS compliance, this device offers a balance of performance, integration and board-level practicality for designs that need scalable, reprogrammable logic without excessive package size.
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