LFE2-12SE-5FN256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 147 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-5FN256I – ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA
The LFE2-12SE-5FN256I is an ECP2 Field Programmable Gate Array (FPGA) offering 12,000 logic elements and 193 I/O in a 256-ball BGA package. It provides embedded on-chip memory and low-voltage operation in an industrial-grade, surface-mount package for designs that require programmable logic resources with a compact footprint.
Key Features
- Logic Capacity Provides 12,000 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory Includes a total of 226,304 bits of on-chip RAM (approximately 0.226 Mbits) for local buffering, state storage, and small lookup tables.
- I/O Resources Offers 193 user I/O pins to support a wide range of peripheral and parallel interfaces.
- Low-Voltage Core Operates from a core supply range of 1.14 V to 1.26 V, enabling compatibility with low-voltage system architectures.
- Package & Mounting Supplied in a 256-ball FPBGA (17 × 17) package designed for surface-mount assembly, delivering a high pin-count in a compact footprint.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for applications that require extended temperature tolerance.
- Regulatory Compliance RoHS compliant, supporting lead-free manufacturing processes and regulatory requirements.
Unique Advantages
- Substantial Logic Density: 12,000 logic elements enable implementation of sizable programmable logic functions while keeping design consolidation in a single device.
- On-Chip Memory for Local Storage: Approximately 0.226 Mbits of embedded RAM reduces dependence on external memory for small buffers and state machines.
- High I/O Count in Compact Package: 193 I/Os in a 256-ball FPBGA (17 × 17) package maximize connectivity without excessive board area.
- Industrial Temperature Capability: −40 °C to 100 °C rating supports deployment in environments with wide temperature variation.
- Low-Voltage Operation: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system designs to help reduce overall power consumption.
- Surface-Mount Form Factor: 256-ball BGA surface-mount package facilitates automated assembly and high-density PCB layouts.
Why Choose LFE2-12SE-5FN256I?
The LFE2-12SE-5FN256I combines substantial programmable-logic capacity, embedded RAM, and a high I/O count in a compact 256-ball BGA package, making it well suited for engineers seeking to consolidate digital functions into a single FPGA. Its industrial temperature range and RoHS compliance provide robustness for extended-temperature and lead-free manufacturing requirements.
Choose this device when your design requires a balance of logic resources, local memory, and connectivity in a low-voltage, surface-mount FPGA form factor that is intended for industrial applications.
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