LFE2-12SE-5F256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 364 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-5F256I – ECP2 FPGA, 12,000 Logic Elements, 256-BGA
The LFE2-12SE-5F256I is an industrial-grade Field Programmable Gate Array (FPGA) from the Lattice ECP2 family. It provides 12,000 logic elements in a compact 256-ball fpBGA (17 × 17 mm) package and targets designs that require mid-range logic density, flexible I/O and on-chip embedded memory.
Designed for system integration, the device delivers a combination of programmable logic, embedded RAM and a high I/O count suitable for industrial and communications-focused applications where temperature range, compact package and RoHS compliance are important.
Key Features
- Logic Capacity — 12,000 logic elements for implementing mid-density logic and custom hardware functions.
- Embedded Memory — 226,304 bits of on-chip RAM (approximately 0.23 Mbits) to support buffering, state machines and small data stores.
- I/O Density — 193 I/O pins to support wide peripheral and interface connectivity in a single device.
- Package — 256-ball fpBGA, supplier package 256-FPBGA (17×17 mm), providing a compact board footprint with high pin density.
- Power — Core supply range 1.14 V to 1.26 V to match platform power rails and optimize system power delivery.
- Industrial Temperature — Rated for operation from −40 °C to 100 °C for robust performance in demanding environments.
- Mounting & Compliance — Surface-mount device; RoHS compliant.
- Family-Level Capabilities — As part of the Lattice ECP2 family, the series includes high logic density, flexible memory resources and family-level design support such as Lattice Diamond design software (refer to family datasheet for details).
Typical Applications
- Industrial Control — Implement custom control logic, protocol handling and I/O aggregation within industrial automation systems using the device’s extended temperature range and I/O count.
- Communications Interfaces — Support protocol bridging, custom interface logic and peripheral interfacing where moderate logic density and flexible I/O are required.
- Embedded System Integration — Integrate glue logic, sequencers and state machines to reduce BOM and consolidate functions onto a single FPGA.
- Prototyping & Custom Hardware — Mid-density FPGA resource for rapid hardware prototyping and deployment of application-specific accelerators or controllers.
Unique Advantages
- Mid-Range Logic in a Compact Footprint: 12,000 logic elements in a 17 × 17 mm 256-FPBGA package reduces board area while providing substantial programmable resources.
- Substantial I/O Count: 193 I/Os enable consolidation of multiple peripheral interfaces and simplify board-level routing for complex systems.
- On-Chip Memory: Approximately 0.23 Mbits of embedded RAM supports buffering and local data storage without external memory in many use cases.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh and thermally variable environments.
- Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with modern platform power domains for efficient system integration.
- RoHS Compliant & Surface Mount: Facilitates modern manufacturing processes and regulatory compliance for commercial and industrial products.
- Family-Level Design Support: The ECP2 family is supported by Lattice design tools and documented family features to help accelerate development (see family datasheet for details).
Why Choose LFE2-12SE-5F256I?
The LFE2-12SE-5F256I positions itself as a practical choice for engineers needing a mid-density, industrial-temperature FPGA with a compact BGA package and a high count of general-purpose I/Os. Its combination of 12,000 logic elements, embedded RAM and robust operating range makes it suitable for consolidating control logic, interface functions and custom hardware acceleration in industrial and communications products.
Choosing this device provides a balance of programmable capacity, I/O flexibility and manufacturability, backed by the documented capabilities of the Lattice ECP2 family and associated design tool support to help move designs from prototype to production.
If you would like pricing or availability for LFE2-12SE-5F256I, request a quote or submit an inquiry to receive a formal sales response and procurement options.

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