LFE2-12SE-5F256C

IC FPGA 193 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA

Quantity 914 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O193Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFE2-12SE-5F256C – ECP2 FPGA, 12,000 logic elements, 256‑BGA

The LFE2-12SE-5F256C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation's ECP2 family. It delivers 12,000 logic elements and 1,500 LABs together with 226,304 bits of on-chip RAM to support mid-range programmable logic requirements.

Packaged in a 256-BGA (supplier package: 256-FPBGA 17×17) surface-mount package, the device provides 193 I/O pins and operates from a 1.14 V to 1.26 V core supply. It is specified for commercial-grade operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Core Logic 12,000 logic elements and 1,500 LABs provide programmable logic capacity for a range of mid-level designs.
  • Embedded Memory Approximately 0.226 Mbits of on-chip RAM (226,304 bits) for buffering, FIFOs, and local storage.
  • I/O Density 193 general-purpose I/O pins to support multiple interfaces and board-level connectivity.
  • Package and Mounting 256-BGA package (256-FPBGA, 17×17) with surface-mount mounting for compact, high-density board layouts.
  • Power Core voltage supply range from 1.14 V to 1.26 V for core power planning and regulator selection.
  • Temperature and Grade Commercial grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant for lead-free manufacturing and assembly processes.

Unique Advantages

  • High logic capacity in a compact package: 12,000 logic elements with 193 I/O in a 256-BGA footprint enables dense designs without a large board area.
  • On-chip memory for local buffering: 226,304 bits of embedded RAM reduce dependence on external memory for common buffering and state storage needs.
  • Clear power envelope: Narrow core voltage range (1.14 V–1.26 V) simplifies core power supply selection and design.
  • Surface-mount, assembly-friendly package: 256-FPBGA (17×17) supports standard PCB assembly and inspection flows.
  • RoHS compliant: Suitable for lead-free manufacturing requirements.

Why Choose LFE2-12SE-5F256C?

LFE2-12SE-5F256C positions itself as a mid-range FPGA option within the ECP2 family, combining 12,000 logic elements, on-chip RAM, and a high I/O count in a compact 256-BGA package. Its defined power and temperature specifications make it suitable for commercial designs that require a balance of integration and predictable electrical characteristics.

This device is appropriate for designers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with measurable logic, memory, and I/O resources backed by Lattice Semiconductor Corporation's ECP2 family documentation.

Request a quote or submit a procurement inquiry for the LFE2-12SE-5F256C to receive pricing and availability details.

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