LFE2-12E-7Q208C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 226304 12000 208-BFQFP |
|---|---|
| Quantity | 1,216 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-7Q208C – ECP2 Field Programmable Gate Array (FPGA) IC, 131 I/O, ~226,304 bits RAM, 12,000 logic elements, 208-BFQFP
The LFE2-12E-7Q208C is a commercial-grade ECP2 family FPGA from Lattice Semiconductor Corporation. It delivers a balanced combination of programmable logic, on-chip RAM, and I/O density suitable for a wide range of embedded control, interface, and custom logic designs. With 12,000 logic elements and 131 user I/O pins in a 208-BFQFP surface-mount package, this device targets applications that require moderate logic capacity and flexible I/O in a compact footprint.
Key Features
- Core Logic 12,000 logic elements provide the device’s core programmable resources for implementing custom digital functions.
- Embedded Memory Approximately 0.226 Mbits of on-chip RAM (226,304 bits) to support buffering, state machines, and small data-storage needs.
- I/O Resources 131 user I/O pins for interfacing with peripherals, sensors, and other system components.
- Power Operates from a core voltage supply in the range of 1.14 V to 1.26 V to match system power domains.
- Package and Mounting 208-BFQFP (208-PQFP 28×28) surface-mount package offering a compact, board-friendly footprint.
- Operating Range Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS-compliant construction for environmental regulatory alignment.
Typical Applications
- Embedded System Control Implement control logic and state machines that benefit from 12,000 logic elements and local RAM for buffering and temporary data storage.
- Interface Bridging Bridge and translate between multiple digital interfaces using the device’s 131 I/O pins to connect diverse peripherals and signals.
- Prototyping and Custom Logic Rapidly prototype custom digital functions where moderate logic density and board-level integration in a 208-BFQFP package are required.
- Sensor Aggregation and Preprocessing Aggregate and preprocess data from multiple sensors using available I/O and embedded memory for temporary storage and preprocessing tasks.
Unique Advantages
- Balanced Logic Capacity: 12,000 logic elements provide a mid-range programmable resource set for a wide variety of control and interface tasks without oversizing.
- On-Chip RAM for Local Storage: Approximately 0.226 Mbits of embedded memory supports buffering and small lookup tables, reducing external memory needs.
- High I/O Count: 131 user I/Os simplify board-level routing for multi-peripheral designs and reduce the need for external I/O expanders.
- Compact Surface-Mount Package: 208-BFQFP (28×28) package enables dense PCB layouts while maintaining accessibility for signal routing and assembly.
- Commercial Temperature Grade: Rated for 0 °C to 85 °C operation, suitable for standard commercial embedded applications.
- RoHS Compliant: Environmentally compliant manufacturing supports regulatory goals for lead-free product designs.
Why Choose LFE2-12E-7Q208C?
The LFE2-12E-7Q208C offers a pragmatic combination of logic, memory, and I/O in a compact 208-BFQFP package from Lattice Semiconductor Corporation. It is well suited to engineers and designers who need a moderate-density FPGA for embedded control, interface bridging, prototyping, and sensor aggregation while maintaining a small board footprint and RoHS compliance.
Choosing this part provides scalable programmable resources and on-chip memory to simplify system architecture and reduce the need for additional discrete components, making it a practical option for commercial embedded designs.
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