LFE2-12E-7FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA |
|---|---|
| Quantity | 59 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 297 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-7FN484C – ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA
The LFE2-12E-7FN484C is a field programmable gate array (FPGA) in the ECP2 family, offering a mid-range balance of logic capacity, on-chip memory, and I/O density. It is provided in a 484-ball BGA package and is targeted at commercial-grade digital designs that require configurable logic, substantial embedded memory, and a high number of external interfaces.
With 12,000 logic elements, approximately 0.226 Mbits of embedded RAM, and 297 I/Os, this device supports designs that need moderate logic resources together with broad external connectivity while operating from a 1.14 V to 1.26 V core supply.
Key Features
- Core Logic 12,000 logic elements provide a flexible fabric for implementing custom digital logic and moderate-complexity functions.
- Embedded Memory Approximately 0.226 Mbits of on-chip RAM to support packet buffers, small data tables, and state storage within the FPGA fabric.
- I/O Density 297 user I/Os enable extensive external interfacing for peripherals, sensors, buses, and high-pin-count system connections.
- Power Core supply voltage range of 1.14 V to 1.26 V for the device core power domain.
- Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB integration.
- Operating Range and Grade Commercial temperature rating with an operating range of 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant for lead-free manufacturing processes.
Typical Applications
- High-density digital logic designs Implement custom state machines, protocol handling, and glue logic using 12,000 logic elements and on-chip RAM for local data storage.
- Multi-interface systems Leverage 297 I/Os to connect multiple external peripherals, sensor arrays, or parallel interfaces without external I/O expanders.
- Embedded processing accelerators Use the combination of logic capacity and embedded RAM for hardware accelerators, buffering, and real-time data path processing.
Unique Advantages
- Balanced resource profile: 12,000 logic elements combined with ~0.226 Mbits of RAM offers a practical mix of logic and memory for mid-range designs.
- High external connectivity: 297 I/Os reduce the need for additional interface components, simplifying board-level design and reducing BOM count.
- Compact BGA package: 484-ball FPBGA (23×23) enables dense PCB layouts while keeping a small footprint for space-constrained systems.
- Commercial temperature rating: 0 °C to 85 °C supports typical commercial applications and environments.
- RoHS compliant: Meets lead-free manufacturing requirements for modern assembly processes.
Why Choose LFE2-12E-7FN484C?
The LFE2-12E-7FN484C positions itself as a mid-range FPGA option that combines substantial I/O capability with a practical amount of logic and embedded RAM. It is well-suited for engineers who need to implement configurable digital functions, interface with numerous external devices, and retain on-chip memory for buffering or state storage within a compact BGA package.
This device is appropriate for commercial designs requiring a reliable, solderable surface-mount FPGA with clearly defined operating voltage and temperature ranges. Its resource mix and package make it a good fit where board space, I/O count, and moderate logic capacity are primary considerations.
Request a quote or submit your pricing inquiry to receive availability and lead-time information for the LFE2-12E-7FN484C.

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