LFE2-12E-6TN144I

IC FPGA 93 I/O 144TQFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP

Quantity 955 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O93Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFE2-12E-6TN144I – ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP

The LFE2-12E-6TN144I is an FPGA device from Lattice Semiconductor's ECP2 family, offering reconfigurable logic in a compact 144-LQFP surface-mount package. It targets industrial-grade embedded designs that require a balance of logic density, on-chip memory, and a broad operating temperature range.

With 12,000 logic elements, approximately 0.226 Mbits of embedded memory, and 93 general-purpose I/O, this device supports custom logic, I/O interfacing, and medium-complexity datapath functions while operating from a low-voltage supply of 1.14 V to 1.26 V.

Key Features

  • Core Logic: 12,000 logic elements for implementing custom combinational and sequential logic functions.
  • Embedded Memory: Approximately 0.226 Mbits of on-chip RAM (226,304 bits) to support FIFOs, buffers, and local data storage.
  • I/O Capacity: 93 I/O pins to support multiple peripheral interfaces and external device connectivity.
  • Power Supply: Low-voltage operation with a supply range of 1.14 V to 1.26 V for power-sensitive designs.
  • Package & Mounting: 144-pin LQFP package (supplier device package listed as 144‑TQFP 20×20) with surface-mount mounting type for compact PCB layouts.
  • Industrial Temperature Range: Rated to operate from −40 °C to 100 °C, suitable for thermally demanding environments.
  • Regulatory Compliance: RoHS compliant for environmentally conscious manufacturing and assembly.

Typical Applications

  • Industrial Control: Implement custom control logic and I/O glue in automation and control equipment, leveraging industrial temperature rating and I/O density.
  • Embedded Systems: Provide reconfigurable logic and on-chip memory for medium-complexity embedded processing tasks and peripheral interfacing.
  • Communications and Networking: Handle protocol bridging, parallel data paths, and I/O aggregation where configurable logic and local RAM are required.
  • Prototyping and Development: Ideal for evaluating custom logic, validating interfaces, and developing firmware/hardware co-designs in a compact SMD package.

Unique Advantages

  • Balanced Logic Density: 12,000 logic elements provide a mid-range capacity suitable for a wide range of custom logic tasks without excessive board area.
  • Useful On-Chip Memory: Approximately 0.226 Mbits of embedded RAM reduces reliance on external memory for buffers and local storage.
  • Industrial Reliability: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
  • Compact, Surface-Mount Package: 144-LQFP / 144-TQFP (20×20) footprint enables high-density PCB implementations while providing a substantial I/O count.
  • Low-Voltage Operation: 1.14 V to 1.26 V supply window helps designs targeting reduced power consumption.
  • RoHS Compliant: Meets common environmental regulations for modern electronics manufacturing.

Why Choose LFE2-12E-6TN144I?

The LFE2-12E-6TN144I offers a practical combination of logic capacity, on-chip memory, and I/O in an industrial-grade FPGA package from Lattice Semiconductor. Its specifications make it well suited for engineers building medium-complexity embedded systems, industrial controls, and communication interface modules that require reconfigurable logic and reliable operation across a wide temperature range.

Choosing this device provides a compact, RoHS-compliant FPGA solution that balances integration and thermal robustness, enabling designers to reduce external components while maintaining flexibility for iterative development and deployment.

Request a quote or submit an inquiry to discuss availability, pricing, and how LFE2-12E-6TN144I can fit into your next design.

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