LFE2-12E-6TN144I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP |
|---|---|
| Quantity | 955 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 93 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-6TN144I – ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP
The LFE2-12E-6TN144I is an FPGA device from Lattice Semiconductor's ECP2 family, offering reconfigurable logic in a compact 144-LQFP surface-mount package. It targets industrial-grade embedded designs that require a balance of logic density, on-chip memory, and a broad operating temperature range.
With 12,000 logic elements, approximately 0.226 Mbits of embedded memory, and 93 general-purpose I/O, this device supports custom logic, I/O interfacing, and medium-complexity datapath functions while operating from a low-voltage supply of 1.14 V to 1.26 V.
Key Features
- Core Logic: 12,000 logic elements for implementing custom combinational and sequential logic functions.
- Embedded Memory: Approximately 0.226 Mbits of on-chip RAM (226,304 bits) to support FIFOs, buffers, and local data storage.
- I/O Capacity: 93 I/O pins to support multiple peripheral interfaces and external device connectivity.
- Power Supply: Low-voltage operation with a supply range of 1.14 V to 1.26 V for power-sensitive designs.
- Package & Mounting: 144-pin LQFP package (supplier device package listed as 144‑TQFP 20×20) with surface-mount mounting type for compact PCB layouts.
- Industrial Temperature Range: Rated to operate from −40 °C to 100 °C, suitable for thermally demanding environments.
- Regulatory Compliance: RoHS compliant for environmentally conscious manufacturing and assembly.
Typical Applications
- Industrial Control: Implement custom control logic and I/O glue in automation and control equipment, leveraging industrial temperature rating and I/O density.
- Embedded Systems: Provide reconfigurable logic and on-chip memory for medium-complexity embedded processing tasks and peripheral interfacing.
- Communications and Networking: Handle protocol bridging, parallel data paths, and I/O aggregation where configurable logic and local RAM are required.
- Prototyping and Development: Ideal for evaluating custom logic, validating interfaces, and developing firmware/hardware co-designs in a compact SMD package.
Unique Advantages
- Balanced Logic Density: 12,000 logic elements provide a mid-range capacity suitable for a wide range of custom logic tasks without excessive board area.
- Useful On-Chip Memory: Approximately 0.226 Mbits of embedded RAM reduces reliance on external memory for buffers and local storage.
- Industrial Reliability: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
- Compact, Surface-Mount Package: 144-LQFP / 144-TQFP (20×20) footprint enables high-density PCB implementations while providing a substantial I/O count.
- Low-Voltage Operation: 1.14 V to 1.26 V supply window helps designs targeting reduced power consumption.
- RoHS Compliant: Meets common environmental regulations for modern electronics manufacturing.
Why Choose LFE2-12E-6TN144I?
The LFE2-12E-6TN144I offers a practical combination of logic capacity, on-chip memory, and I/O in an industrial-grade FPGA package from Lattice Semiconductor. Its specifications make it well suited for engineers building medium-complexity embedded systems, industrial controls, and communication interface modules that require reconfigurable logic and reliable operation across a wide temperature range.
Choosing this device provides a compact, RoHS-compliant FPGA solution that balances integration and thermal robustness, enabling designers to reduce external components while maintaining flexibility for iterative development and deployment.
Request a quote or submit an inquiry to discuss availability, pricing, and how LFE2-12E-6TN144I can fit into your next design.

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Headquarters: Hillsboro, Oregon, USA
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