LFE2-12E-6QN208I

The LFE2-12E-6QN208I is an ECP2 family Field Programmable Gate Array (FPGA) offered by Lattice Semiconductor Corporation. It provides approximately 12,000 logic elements, roughly 226,304 bits of on-chip RAM, and up to 131 general-purpose I/O pins in a 208-BFQFP surface-mount package.

Designed and specified for industrial-grade operation, this device targets applications that require moderate logic density, on-chip memory, and reliable operation across a wide temperature range. Key electrical and mechanical attributes include a 1.14 V to 1.26 V core supply requirement and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  Approximately 12,000 logic elements suitable for implementing custom logic, state machines, and glue logic for system integration.
• Embedded Memory  Approximately 226,304 bits (~0.226 Mbits) of on-chip RAM for data buffering, FIFOs, and small memory arrays.
• I/O Capacity  131 available I/O pins to support multiple peripheral interfaces and signal routing within compact system designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount form factor for board-level assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet environmental demands in industrial applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Suitable for control and automation modules where the industrial temperature rating (−40 °C to 100 °C) and ample I/O count are required.
• I/O Expansion & Protocol Bridging  Use as an interface or bridge device leveraging 131 I/Os to connect multiple peripherals or legacy interfaces.
• Memory-Dependent Logic  On-chip RAM (approx. 226,304 bits) supports buffering and data staging for signal processing and state machines.

Unique Advantages

• Moderate Logic Density: Approximately 12,000 logic elements provide a balance of capacity for complex glue logic without excessive board-level overhead.
• Integrated On-Chip RAM: ~226,304 bits of embedded memory reduce external memory requirements for many designs.
• High I/O Count: 131 I/Os simplify integration with multiple peripherals and expanders, reducing the need for additional interface chips.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in a wide range of industrial environments.
• Surface-Mount Packaging: 208-BFQFP (208-PQFP 28×28) offers a compact, PCB-friendly footprint for production assembly.
• Regulatory Compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose LFE2-12E-6QN208I?

The LFE2-12E-6QN208I positions itself as a practical FPGA choice where a combination of solid logic capacity, embedded RAM, and a generous I/O complement are required within an industrial temperature envelope. Its 208-BFQFP surface-mount package and defined core voltage range make it straightforward to integrate on compact PCBs.

This device is suited for designers and procurement teams seeking a reliable, industrial-grade FPGA from Lattice Semiconductor Corporation for applications that demand moderate programmable logic, on-chip memory resources, and robust environmental performance.

Request a quote or submit a purchase inquiry for the LFE2-12E-6QN208I to discuss availability and pricing for your project requirements.