LFE2-12E-6FN484I

The LFE2-12E-6FN484I is an industrial-grade ECP2 series FPGA in a 484-ball BGA package. It provides a combination of programmable logic resources, embedded memory, and a high I/O count for designs that require moderate logic capacity and broad interfacing in industrial environments.

This device is built for applications that demand reprogrammable logic with a wide operating temperature range and a compact surface-mount 484-FPBGA (23×23) footprint. Its supply and environmental specifications support deployment in temperature- and power-constrained systems.

Key Features

• Logic Resources 1500 configurable logic blocks (CLBs) and 12,000 logic elements provide the programmable fabric for custom digital functions and control logic.
• Embedded Memory Approximately 0.226 Mbits of on-chip RAM (226,304 total RAM bits) for buffers, FIFOs, and small data stores.
• I/O Capacity 297 user I/O pins to support multiple interfaces, parallel connections, and dense peripheral integration.
• Power Supply Supported core voltage range from 1.14 V to 1.26 V for compatible power-rail designs.
• Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA 23×23) in a surface-mount form factor for compact board integration.
• Temperature Range Industrial operating range from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS-compliant construction to meet common environmental and manufacturing standards.

Typical Applications

• Industrial Control and Automation Use the device’s industrial temperature rating and programmable logic to implement custom control algorithms and interface with sensors and actuators.
• Data Acquisition and Sensor Interfaces Leverage the high I/O count and on-chip RAM for buffering and conditioning multichannel sensor data.
• Communications and Protocol Bridging Implement protocol conversion and custom interface logic using the available logic elements and abundant I/O.
• Embedded System Prototyping Provide a reprogrammable platform for validation of control logic and peripheral integration in industrial-grade prototypes.

Unique Advantages

• Balanced Logic Density: 12,000 logic elements and 1500 CLBs deliver substantial programmable resources for midrange FPGA applications without excessive board area.
• Generous I/O Count: 297 I/O pins simplify system integration and reduce the need for external multiplexing components.
• On-Chip Memory for Real-Time Tasks: Approximately 0.226 Mbits of embedded RAM supports buffering, small lookup tables, and runtime data storage.
• Industrial Temperature Capability: Rated from -40 °C to 100 °C to meet the environmental demands of industrial deployments.
• Compact BGA Footprint: 484-FPBGA (23×23) surface-mount package enables dense PCB layouts for space-constrained designs.
• RoHS Compliance: Environmentally compliant manufacturing helps simplify regulatory considerations for assembly.

Why Choose LFE2-12E-6FN484I?

The LFE2-12E-6FN484I positions itself as a practical choice for industrial and embedded designs that require a balance of programmable logic, embedded memory, and a high number of I/Os in a compact BGA package. Its supply voltage window and wide operating temperature range make it suitable for systems that must operate reliably in varied power and thermal conditions.

This device is well suited to engineers and procurement teams seeking a reprogrammable logic solution with moderate logic density, ample I/O, and industrial-grade temperature support for applications such as control systems, data acquisition, protocol bridging, and embedded prototyping.

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