LFE2-12E-6Q208I

IC FPGA 131 I/O 208QFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 131 226304 12000 208-BFQFP

Quantity 1,273 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O131Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFE2-12E-6Q208I – ECP2 Field Programmable Gate Array (FPGA) IC 131 I/O, 226,304 bits RAM, 12,000 Logic Elements, 208-BFQFP

The LFE2-12E-6Q208I is an ECP2 family FPGA from Lattice Semiconductor designed for mid-range, industrial embedded applications. It provides approximately 12,000 logic elements and roughly 226,304 bits (≈0.23 Mbits) of embedded memory in a 208-pin surface-mount BFQFP package, with 131 user I/Os and an industrial operating temperature range.

This device is targeted at systems that require a balance of logic density, on-chip memory and flexible I/O in a 28 × 28 mm PQFP-style footprint, supporting industrial-temperature operation and RoHS compliance.

Key Features

  • Logic Capacity: Approximately 12,000 logic elements suitable for mid-range digital integration and glue-logic consolidation.
  • On-chip Memory: Approximately 226,304 bits of embedded RAM (≈0.23 Mbits) with 12 embedded block RAM (EBR) blocks and 24 Kbits of distributed RAM as defined for the ECP2-12 device family.
  • DSP Resources: Family-level sysDSP resources (ECP2-12 specification includes 6 sysDSP blocks and 24 18×18 multipliers) for efficient multiply–accumulate and signal processing functions.
  • I/O and Interface Flexibility: 131 user I/Os in the 208-BFQFP package with programmable sysI/O buffer support for a wide range of common signaling standards and source-synchronous interfaces.
  • Clocking and Timing: On-chip PLLs and DLLs available in the ECP2 family to support clock multiplication/division and phase/delay adjustment for system timing.
  • Configuration and System Tools: Boundary-scan (1149.1) compliance, SPI boot flash interface and dual-boot image support; includes on-chip oscillator and ispTRACY internal logic analyzer capability as part of the family feature set.
  • Power and Supply: Core voltage supply range of 1.14 V to 1.26 V for compatibility with family-defined power domains.
  • Package and Mounting: 208-BFQFP (supplier package listed as 208-PQFP, 28 × 28 mm), surface-mount; RoHS compliant.
  • Industrial Temperature Range: Rated for operation from −40 °C to 100 °C, suitable for industrial environments.

Typical Applications

  • Industrial Control: Deterministic logic, I/O aggregation and on-board signal processing for motor control, PLC I/O expansion and factory automation modules.
  • Communications and Protocol Bridging: Mid-range interface logic, protocol conversion and packet buffering where flexible I/O and embedded memory are required.
  • Instrumentation and Test Equipment: Custom data path logic, local preprocessing and timing control in rack-mounted or benchtop measurement systems operating in industrial temperatures.
  • Embedded System Glue Logic: Peripheral aggregation, bus bridging and custom control functions to reduce external component count and simplify PCB designs.

Unique Advantages

  • Balanced Logic and Memory: Approximately 12,000 logic elements combined with ~0.23 Mbits of embedded RAM provide a compact platform for mid-size FPGA designs without excessive external memory.
  • Integrated DSP Capability: Family sysDSP blocks and dedicated multipliers enable efficient implementation of multiply–accumulate and signal-processing operations on-chip.
  • Flexible I/O in a PQFP Footprint: 131 I/Os in a 208-pin BFQFP package give a high I/O count for a low-profile surface-mount package, suitable for space-constrained boards.
  • Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments and designs requiring extended temperature operation.
  • System-Level Configuration Features: Boundary-scan, SPI boot and dual-boot options support robust system configuration and field update strategies.
  • Design Ecosystem: ECP2 family features such as on-chip clocking resources and internal debugging (ispTRACY) help streamline development and bring-up.

Why Choose LFE2-12E-6Q208I?

The LFE2-12E-6Q208I positions itself as a practical mid-range FPGA option for industrial embedded systems that need a mix of logic density, embedded memory and a flexible I/O configuration in a 208-pin PQFP-class package. Its family-level DSP blocks, on-chip RAM and configuration features reduce external component count and simplify system architecture.

This device is well suited to engineers and procurement teams designing industrial controls, communications interfaces, instrumentation and embedded platforms that require proven family features, industrial temperature operation and a compact surface-mount package.

Request a quote or submit an inquiry for pricing and availability to get started with the LFE2-12E-6Q208I for your next design.

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