LFE2-12E-6FN256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 203 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-6FN256I – ECP2 FPGA, 12,000 logic elements, 256‑BGA
The LFE2-12E-6FN256I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It integrates 12,000 logic elements with 226,304 bits of on-chip RAM and provides 193 I/O pins in a 256-BGA package.
Designed for industrial-temperature operation (–40 °C to 100 °C) and RoHS compliance, this surface-mount FPGA offers a compact, low-voltage solution (1.14 V to 1.26 V) for designs that require a balance of logic density, embedded memory, and I/O capability.
Key Features
- Core / Logic Provides 12,000 logic elements suitable for mid-range programmable logic implementations.
- Embedded Memory Approximately 0.226 Mbits (226,304 bits) of on-chip RAM to support buffering, state storage, and small data tables.
- I/O Density 193 programmable I/O pins enable connectivity to a variety of external devices and interfaces.
- Package 256-BGA (256-FPBGA, 17×17) package delivers a high-pin-count footprint in a compact surface-mount form factor.
- Power Nominal core supply range of 1.14 V to 1.26 V for low-voltage system integration.
- Temperature & Grade Industrial-grade device rated for operation from –40 °C to 100 °C, supporting thermally demanding environments.
- Compliance & Mounting RoHS compliant and specified for surface-mount PCB assembly.
Unique Advantages
- High logic density: 12,000 logic elements provide capacity for complex control, glue logic, and protocol handling without external ASICs.
- Balanced on-chip memory: Approximately 0.226 Mbits of embedded RAM supports local buffering and state retention, reducing dependence on external memory for modest data needs.
- Generous I/O in a compact package: 193 I/Os in a 256-BGA footprint deliver flexibility for multi-interface designs while conserving PCB area.
- Industrial temperature range: Rated –40 °C to 100 °C, suitable for deployments that require extended temperature operation.
- Low-voltage operation: 1.14 V to 1.26 V supply range supports integration into low-voltage power rails to help minimize system power consumption.
- RoHS compliant: Meets lead-free environmental requirements for modern manufacturing and regulatory environments.
Why Choose LFE2-12E-6FN256I?
The LFE2-12E-6FN256I is positioned for designs that need a mid-range FPGA with a mix of logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its industrial operating range and RoHS compliance make it suitable for applications where environmental robustness and regulatory compliance are required.
Engineers and procurement teams can rely on the combination of 12,000 logic elements, approximately 0.226 Mbits of on-chip RAM, and 193 I/Os to deliver a flexible building block for modular, scalable designs from prototype through production.
Request a quote or submit an inquiry to receive pricing and availability information for the LFE2-12E-6FN256I.
