LFE2-12E-6F484C

The LFE2-12E-6F484C is an ECP2 family Field Programmable Gate Array (FPGA) offering 12,000 logic elements in a 484-ball BGA package. It provides a combination of programmable logic density, on-chip embedded memory and substantial I/O count for commercial-grade designs.

Key device attributes include approximately 0.226 Mbits of embedded RAM (226,304 total RAM bits), 297 user I/O pins, surface-mount 484-FPBGA (23×23) packaging, low-voltage operation from 1.14 V to 1.26 V, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic 12,000 logic elements for implementing custom digital functions and user-defined hardware accelerators.
• Embedded Memory Approximately 0.226 Mbits (226,304 bits) of on-chip RAM to support buffering, state storage and small lookup tables.
• I/O Density 297 user I/O pins to accommodate high port counts and multiple parallel interfaces.
• Power Low-voltage core supply range of 1.14 V to 1.26 V to suit power-sensitive designs.
• Package & Mounting 484-ball FPBGA (23×23) package, surface-mountable for compact board placement.
• Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory Compliance RoHS compliant to support lead-free assembly processes.

Typical Applications

• Custom Logic and Acceleration Implement user-defined state machines, protocol handlers or hardware accelerators using 12,000 logic elements.
• Memory-backed Interfaces Use the on-chip embedded RAM for buffering and temporary data storage in streaming or interface bridging tasks.
• High-density I/O Systems Support multiple parallel interfaces and external peripherals with 297 available I/O pins.
• Compact Surface-mount Designs Deploy in space-constrained PCBs using the 484-FPBGA (23×23) surface-mount package.

Unique Advantages

• Balanced Logic and Memory: 12,000 logic elements paired with 226,304 bits of embedded RAM provide a practical balance for mid-range programmable designs.
• High I/O Count: 297 I/Os reduce the need for external I/O expanders and simplify board-level connectivity.
• Low-voltage Operation: 1.14 V to 1.26 V core supply enables integration into low-power architectures and modern power domains.
• Compact BGA Packaging: 484-FPBGA (23×23) allows for a condensed board footprint while maintaining thermal and signal routing advantages of BGA packages.
• Commercial Grade Reliability: Rated for 0 °C to 85 °C operation to match standard commercial product environments.
• RoHS Compliant: Supports lead-free manufacturing processes and associated supply-chain requirements.

Why Choose LFE2-12E-6F484C?

The LFE2-12E-6F484C positions itself as a mid-range ECP2 FPGA option that combines a practical logic element count, embedded memory, and a high I/O density in a compact surface-mount BGA package. Its low-voltage core and commercial temperature rating make it well suited for a wide range of commercial embedded systems where programmable logic, interface flexibility, and board-level density are priorities.

Design teams seeking a balanced FPGA for prototyping, interface bridging, and custom-logic implementations will find the LFE2-12E-6F484C delivers verifiable hardware resources and RoHS compliance to support production assembly and deployment.

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