LFE2-12E-5TN144C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP |
|---|---|
| Quantity | 1,500 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 93 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-5TN144C – ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP
The LFE2-12E-5TN144C is an ECP2 family Field Programmable Gate Array from Lattice Semiconductor Corporation, offered in a 144-LQFP package for surface-mount applications. It provides up to 12,000 logic elements and approximately 226,304 bits of on-chip RAM, along with 93 general-purpose I/Os, making it suitable for commercial designs that require moderate programmable logic capacity and flexible I/O connectivity.
Designed for operation within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C temperature window, this device is presented in a compact 144-pin package for board-level integration where space and pin count are considerations.
Key Features
- Programmable Logic: Up to 12,000 logic elements to implement custom digital functions and control logic within a single device.
- Embedded Memory: Approximately 0.226 Mbits (226,304 bits) of on-chip RAM for buffering, state storage, and small data structures.
- I/O Capability: 93 user I/O pins suitable for interfacing with peripherals, sensors, and external logic.
- Power Supply Range: Core voltage specified from 1.14 V to 1.26 V to match system power architectures that support this supply window.
- Package & Mounting: 144-LQFP package (supplier device package listed as 144-TQFP, 20×20) designed for surface-mount assembly on standard PCBs.
- Commercial Grade Temperature: Rated for operation from 0 °C to 85 °C, appropriate for general commercial electronics environments.
- Regulatory Compliance: RoHS compliant for reduced hazardous substance content in manufactured assemblies.
Typical Applications
- Embedded Control and Logic: Implement glue logic, state machines, and custom control functions using the device’s 12,000 logic elements and on-chip RAM.
- Interface Bridging: Use the 93 I/Os to bridge or translate between multiple peripheral interfaces in compact, board-level systems.
- Prototyping and Development: Deploy in commercial product development where a reprogrammable logic element with moderate memory and I/O is required for iterative design.
Unique Advantages
- Balanced Logic and Memory: The combination of 12,000 logic elements and 226,304 bits of RAM supports a wide range of mid-complexity designs without external memory for many control and buffering tasks.
- Compact, Board-Ready Package: 144-LQFP footprint enables high-density PCB integration while maintaining accessible I/O counts for system connections.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with common commercial product requirements and deployment scenarios.
- Narrow Core Voltage Window: Defined 1.14 V to 1.26 V supply simplifies power rail planning for designs targeting this core voltage range.
- RoHS Compliant: Meets common environmental requirements for consumer and commercial electronics assemblies.
Why Choose LFE2-12E-5TN144C?
The LFE2-12E-5TN144C presents a practical balance of programmable logic, embedded memory, and I/O in a compact 144-pin surface-mount package, making it well suited for commercial designs that need flexible digital implementation without excessive board-level complexity. As part of Lattice Semiconductor's ECP2 offering, it provides predictable resource levels—12,000 logic elements, roughly 226,304 bits of RAM, and 93 I/Os—so designers can plan capacity and interface requirements precisely.
This device is a fit for development and production environments where moderate logic density, on-chip memory, and a commercial operating temperature are primary considerations. Its RoHS compliance and defined supply and temperature specifications support repeatable integration into mainstream electronic products.
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