LFE2-12E-5QN208I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 226304 12000 208-BFQFP |
|---|---|
| Quantity | 304 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-5QN208I – ECP2 Field Programmable Gate Array (FPGA) IC, 131 I/O, 208-BFQFP
The LFE2-12E-5QN208I is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, offered in a 208-BFQFP surface-mount package. It provides mid-range programmable logic capacity with a balance of on-chip memory and I/O suitable for industrial embedded designs.
This device targets industrial applications that require configurable logic, up to 131 external I/O, and operation across a broad temperature range while operating at a low core voltage between 1.14 V and 1.26 V.
Key Features
- Core Logic — Approximately 12,000 logic elements to implement custom digital logic, control functions, and glue logic.
- Embedded Memory — Total on-chip RAM of 226,304 bits (approximately 0.226 Mbits) for data buffering, small FIFOs, and tightly coupled storage.
- I/O Capacity — Up to 131 I/O pins to support peripheral interfaces, bus bridging, and multiple I/O domains.
- Power — Core supply voltage range of 1.14 V to 1.26 V for low-voltage FPGA operation.
- Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28 × 28) in a surface-mount form factor for PCB assembly.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C; specified as industrial grade for deployment in demanding environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implement control logic, state machines, and custom interfaces for factory automation and process control systems using the device’s logic capacity and industrial temperature rating.
- Embedded Systems — Integrate glue logic, peripheral aggregation, and protocol conversion in embedded platforms that benefit from on-chip memory and flexible I/O.
- Interface and I/O Expansion — Use the 131 I/O pins to bridge multiple peripherals, expand bus connectivity, or create custom front-end interfaces.
- Data Buffering and Preprocessing — Leverage the on-chip RAM for local buffering and small-scale preprocessing of sensor or communication data streams.
Unique Advantages
- Balanced Logic and Memory: 12,000 logic elements paired with approximately 0.226 Mbits of embedded RAM provide a practical mid-range resource set for many control and interfacing tasks.
- High I/O Count: 131 I/Os allow flexible connectivity to peripherals, sensors, and external devices without extensive external glue logic.
- Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in temperature-challenging industrial environments.
- Low-Voltage Core Operation: 1.14 V to 1.26 V supply range supports low-power system designs and modern power-rail architectures.
- Compact Surface-Mount Package: 208-BFQFP (28 × 28 PQFP) provides a high-pin-count solution in a board-friendly surface-mount footprint.
- Regulatory Compliance: RoHS compliance eases environmental conformity for commercial and industrial products.
Why Choose LFE2-12E-5QN208I?
The LFE2-12E-5QN208I offers a practical combination of logic density, embedded memory, and high I/O count in a surface-mount 208-BFQFP package, tailored for industrial-grade embedded applications. Its operating range and RoHS compliance make it suitable for long-term deployment in commercial and industrial systems where configurable logic and reliable operation are required.
Engineers designing mid-range FPGA-based solutions will find this device appropriate where a balance of resources, I/O flexibility, and a compact package are priorities. Backed by Lattice Semiconductor Corporation, the part fits into designs that demand stable operating characteristics and a clear specification set for procurement and integration.
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