LFE2-12E-5FN484I

IC FPGA 297 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA

Quantity 667 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O297Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFE2-12E-5FN484I – ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA

The LFE2-12E-5FN484I is an ECP2-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-range programmable logic resource with 12,000 logic elements and embedded RAM for custom digital design implementation.

Designed as a surface-mount device in a 484-ball BGA package, this industrial-grade FPGA offers broad I/O count and a defined operating voltage and temperature window to support deployments that require on-board programmable logic with robust environmental tolerance.

Key Features

  • Core Logic 12,000 logic elements deliver programmable fabric for implementing custom digital functions and finite-state machines.
  • Embedded Memory Approximately 0.226 Mbits of on-chip RAM (226,304 total RAM bits) for buffering, FIFOs, and small on-chip data storage.
  • I/O Capacity 297 I/O pins provide extensive external connectivity for interfaces, peripheral signaling, and board-level integration.
  • Package & Mounting 484-ball BBGA package (supplier device package: 484-FPBGA, 23×23) optimized for surface-mount assembly and high-density board layouts.
  • Power Narrow supply voltage range of 1.14 V to 1.26 V for core operation, enabling predictable power planning.
  • Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C to meet harsher environmental requirements.
  • RoHS Compliance Device is RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

  • Programmable Logic Integration Use the FPGA to implement custom logic, glue logic, and protocol bridging directly on the board.
  • Embedded Memory and Buffering Leverage the on-chip RAM for small data buffers, FIFOs, and low-latency storage close to logic functions.
  • High-Density I/O Systems The 297 I/O pins support designs that require multiple external interfaces or large numbers of GPIOs.

Unique Advantages

  • Balanced Logic and Memory: 12,000 logic elements coupled with 226,304 RAM bits provides a balanced platform for mid-range programmable designs.
  • High I/O Count: Nearly 300 I/Os reduce the need for external multiplexing and simplify board-level connectivity.
  • Industrial Temperature Support: Rated −40 °C to 100 °C for deployment in environments with wide temperature variation.
  • Compact, High-Density Package: 484-ball BGA (23×23) enables space-efficient PCB layouts while supporting a large pin count.
  • Predictable Power Requirements: A defined core voltage range (1.14–1.26 V) assists in power supply selection and thermal planning.
  • RoHS Compliant: Supports lead-free manufacturing processes and regulatory compliance.

Why Choose LFE2-12E-5FN484I?

The LFE2-12E-5FN484I positions itself as a mid-range, industrial-grade FPGA option that combines substantial programmable logic with embedded RAM and extensive I/O, all in a compact BGA footprint. Its documented supply voltage range and wide operating temperature make it suitable for applications that require reliable on-board programmable logic under defined environmental conditions.

This device is appropriate for engineers seeking a scalable, robust FPGA building block for custom digital functions, interface consolidation, and on-chip buffering. The combination of logic capacity, memory, and I/O simplifies board-level design and helps reduce external component count.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the LFE2-12E-5FN484I.

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