LFE2-12E-5FN256I

The LFE2-12E-5FN256I is an ECP2 field programmable gate array (FPGA) offered in a 256-ball BGA package. It provides a programmable fabric with 12,000 logic elements, on-chip embedded memory, and a large number of I/O pins for complex interface and control requirements.

Designed for industrial-grade applications, the device supports operation from -40 °C to 100 °C and supplies within a 1.14 V to 1.26 V window, making it suitable for systems that require programmable logic with defined temperature and power envelopes.

Key Features

• Core Logic  Approximately 12,000 logic elements to implement custom digital functions, state machines, and glue logic.
• Embedded Memory  Approximately 0.226 Mbits (226,304 bits) of on-chip RAM for buffering, LUT-based storage, and small data blocks.
• I/O Capacity  193 general-purpose I/O pins to support multiple interfaces, parallel buses, and extensive external signal connectivity.
• Power  Operates from a 1.14 V to 1.26 V supply range, enabling designs within a defined low-voltage domain.
• Package & Mounting  256-ball FPBGA (17×17) package in a surface-mount form factor for compact board integration.
• Temperature & Grade  Industrial grade operation with an ambient range of -40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

• Industrial Control  Programmable logic and 193 I/Os enable custom control, interfacing, and real-time glue logic in industrial automation systems operating across -40 °C to 100 °C.
• Communications and I/O Bridging  Large I/O count and embedded RAM support protocol bridging, parallel and serial interface aggregation, and custom packet buffering.
• Embedded Processing  12,000 logic elements and on-chip memory provide capacity for offloading deterministic functions and implementing hardware-accelerated datapaths.
• Custom Hardware Prototyping  Surface-mount 256-FPBGA package and ample logic resources make the device suitable for prototyping and small-volume production of custom IP blocks.

Unique Advantages

• Substantial logic capacity: With approximately 12,000 logic elements, the device supports medium-complexity custom logic and state-machine implementations without excessive external components.
• Generous I/O provisioning: 193 I/Os permit extensive external connectivity and the consolidation of multiple interfaces onto a single FPGA.
• Embedded memory on-chip: About 0.226 Mbits of RAM reduces dependence on external memory for small buffers and local data storage.
• Industrial temperature rating: The -40 °C to 100 °C operating range accommodates deployment in harsher ambient conditions.
• Compact BGA footprint: 256-FPBGA (17×17) enables high-density board layouts while maintaining surface-mount assembly compatibility.
• Low-voltage operation: Narrow supply range (1.14 V–1.26 V) supports designs that target defined low-voltage power domains.

Why Choose LFE2-12E-5FN256I?

The LFE2-12E-5FN256I combines a sizable programmable fabric, embedded RAM, and a high I/O count in a compact 256-FPBGA package suited for industrial environments. Its specification set provides a balanced platform for designers needing programmable logic with defined power and temperature characteristics.

This device is well suited to customers implementing mid-range FPGA functions—such as interface consolidation, deterministic control logic, and embedded datapaths—where a predictable supply range, industrial temperature capability, and a high pin count are required for reliable operation.

Request a quote or submit a pricing inquiry for LFE2-12E-5FN256I to get availability and volume pricing information.