LFE2-12E-5F256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 1,048 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-5F256C – ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA
The LFE2-12E-5F256C is a commercial-grade ECP2 family FPGA from Lattice Semiconductor, delivered in a 256-ball fpBGA (17 × 17 mm) package for surface-mount assembly. This device provides a mid-range FPGA fabric with approximately 12,000 logic elements, rich I/O, and on-chip memory to support system integration tasks in communications, control, and embedded processing designs.
Key device-level specifications include 193 I/Os, approximately 226 Kbits of embedded RAM, a 1.14 V–1.26 V core supply window, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core logic – 1,500 logic blocks totaling approximately 12,000 logic elements for implementing mid-density logic functions and control paths.
- Embedded memory – Approximately 226 Kbits of on-chip RAM to support buffers, FIFOs, and small data-storage needs within the FPGA fabric.
- I/O density and flexibility – 193 user I/Os provided in a 256-ball fpBGA package for high-pin-count interface routing and peripheral connectivity.
- Power and package – 256-FPBGA (17 × 17 mm) package, surface-mountable; typical core supply range 1.14 V to 1.26 V.
- Operating range and grade – Commercial grade operation from 0 °C to 85 °C suitable for a wide range of general-purpose embedded applications.
- Regulatory compliance – RoHS compliant for environmental and assembly process compatibility.
- Family-level architecture – Part of the Lattice ECP2/M family which includes features such as enhanced DSP blocks, flexible embedded memory options, programmable PLLs/DLLs, and a wide set of programmable I/O standards (as described in the family datasheet).
Typical Applications
- Embedded control – Implement microcontroller offload, peripheral bridging, and real-time control logic using the device’s logic and memory resources.
- Data buffering and protocol bridging – Use on-chip RAM and dense I/O to implement interface translators, packet buffers, and intermediate data-handling tasks.
- Signal processing acceleration – Leverage the family’s DSP-oriented architecture for multiply-accumulate and medium-scale signal processing blocks.
Unique Advantages
- Balanced mid-range capacity – Approximately 12,000 logic elements and 193 I/Os provide a capable platform for designs that need more integration than small FPGAs without moving to larger form factors.
- Compact BGA package – 256-ball fpBGA (17 × 17 mm) enables high I/O in a small PCB footprint for space-constrained applications.
- Flexible embedded memory – About 226 Kbits of on-chip RAM reduces external memory dependency for many buffering and state-storage tasks.
- Commercial-grade robustness – 0 °C to 85 °C operating range and RoHS compliance align with typical commercial embedded product requirements.
- Family ecosystem – Part of the Lattice ECP2/M family, which is supported by the family datasheet features and design tools for implementation and debugging.
Why Choose LFE2-12E-5F256C?
The LFE2-12E-5F256C combines a mid-density logic fabric with meaningful embedded memory and a high I/O count in a compact fpBGA package, making it a strong candidate for embedded designs that require a balance of integration, I/O, and board-space efficiency. Its supply voltage range and commercial temperature rating suit typical industrial and consumer applications where RoHS compliance is required.
As a member of the Lattice ECP2/M family, this device benefits from the family’s architecture and design-tool support, enabling developers to scale designs within the family while leveraging on-chip memory and DSP-oriented resources for higher integration and simplified system-level design.
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