LFE2-12E-5F256I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 1,072 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-5F256I – ECP2 FPGA, 12,000 Logic Elements, 256-BGA
The LFE2-12E-5F256I is an ECP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It offers 12,000 logic elements and on-chip RAM in a compact 256-BGA package, designed for industrial-grade embedded designs.
With 193 user I/O pins, a low-voltage core supply range of 1.14 V to 1.26 V, and an operating temperature range of −40 °C to 100 °C, this device balances programmable logic capacity, I/O density, and industrial temperature capability for a variety of embedded applications.
Key Features
- Core Logic 12,000 logic elements to implement custom digital logic and state machines.
- Embedded Memory Total on-chip RAM of 226,304 bits (approximately 0.226 Mbits) for data buffering and local storage.
- I/O Resources 193 user I/O pins to support multiple parallel interfaces and external device connections.
- Power Supply Core voltage supply range from 1.14 V to 1.26 V to match low-voltage system architectures.
- Package & Mounting 256-BGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Compliance RoHS compliant, supporting regulatory requirements for restricted substances.
Typical Applications
- Logic-dense embedded systems Implement custom datapaths, state machines, and protocol processing using the 12,000 logic elements and embedded RAM.
- I/O-rich interface bridging Use the 193 I/O pins to connect multiple peripherals, sensors, or high-channel-count interfaces.
- Industrial control and instrumentation Designed to operate across −40 °C to 100 °C for temperature-challenging industrial environments.
Unique Advantages
- Balanced logic and memory capacity: 12,000 logic elements paired with 226,304 bits of on-chip RAM provide a practical balance for mid-density designs without external memory requirements in many use cases.
- High I/O count: 193 user I/O pins enable flexible interfacing to a wide range of external devices and parallel signals.
- Compact, manufacturable package: The 256-FPBGA (17×17) surface-mount package supports high-density PCB layouts while maintaining reliable assembly.
- Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
- Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with low-voltage system designs and power-optimized architectures.
- Regulatory compliance: RoHS compliance eases integration into products targeting markets with restricted substance requirements.
Why Choose LFE2-12E-5F256I?
The LFE2-12E-5F256I is positioned for engineers and procurement teams seeking a mid-density FPGA with substantial I/O capability and industrial operating range. Its 12,000 logic elements, on-chip RAM, and 193 I/O pins make it suitable for embedded designs that require programmable logic, local memory, and broad peripheral connectivity.
Backed by Lattice Semiconductor Corporation, this industrial-grade FPGA offers a compact package and low-voltage operation for board-level integration where space, power, and temperature stability are key considerations.
Request a quote or submit an inquiry to evaluate the LFE2-12E-5F256I for your next design or volume purchase.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016