LFE2-12E-5FN256C

The LFE2-12E-5FN256C is a commercial-grade FPGA from Lattice Semiconductor Corporation’s ECP2 family. It delivers a balanced combination of logic capacity, on-chip memory and I/O density in a compact 256-BGA package for commercial embedded designs.

With 12,000 logic elements, 193 user I/Os and approximately 0.226 Mbits of embedded memory, this device is targeted at applications that require moderate logic density, significant I/O connectivity and low-voltage operation (1.14 V to 1.26 V).

Key Features

• Core Logic  Approximately 12,000 logic elements for implementing mid-density digital logic and control functions.
• Embedded Memory  Approximately 0.226 Mbits of on-chip RAM to support buffering, state storage and small data structures without external memory.
• I/O Capacity  193 user I/Os to support multiple interfaces, parallel buses or mixed-signal front-ends requiring many connections.
• Power  Low-voltage supply range of 1.14 V to 1.26 V for designs that target reduced core power consumption and compatibility with low-voltage domains.
• Package & Mounting  256-FPBGA (17×17) package in a 256-BGA form factor designed for surface-mount assembly to minimize board footprint.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Compliance  RoHS compliant for regulatory and environmental conformity in commercial product builds.

Typical Applications

• I/O-Intensive Interface Control  Use the high I/O count to consolidate multiple interface channels, bridges and protocol converters on a single FPGA.
• Mid-Density Logic Integration  Implement control logic, glue logic and custom finite-state machines that require roughly 12,000 logic elements.
• On-Chip Buffering and Data Handling  Leverage the embedded RAM for small buffering tasks, packet staging or localized data storage without external memory.

Unique Advantages

• Balanced resource mix: Combines 12,000 logic elements with embedded RAM and high I/O count to address mid-range integration needs without external glue.
• Compact, high-pin package: The 256-FPBGA (17×17) package provides abundant I/O in a space-efficient surface-mount footprint to reduce PCB area.
• Low-voltage core operation: Narrow supply range (1.14 V–1.26 V) supports designs that prioritize reduced core power and compatibility with low-voltage systems.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial product environments and deployments.
• RoHS compliant: Meets common environmental regulatory requirements for commercial assemblies.

Why Choose LFE2-12E-5FN256C?

The LFE2-12E-5FN256C is positioned for designers who need a mid-density FPGA solution with a strong balance of logic, embedded memory and high I/O in a compact BGA footprint. Its commercial operating range and RoHS compliance make it appropriate for a wide range of commercial embedded systems where board space, I/O count and low-voltage operation matter.

Choose this device when your design requires approximately 12,000 logic elements, nearly 200 I/Os and embedded RAM for local data handling, all packaged in a 256-FPBGA (17×17) surface-mount device from Lattice Semiconductor Corporation.

Request a quote or submit an inquiry to check pricing and availability for the LFE2-12E-5FN256C and to start your procurement process.