LFE2-12E-5Q208C

The LFE2-12E-5Q208C is a commercial-grade Field Programmable Gate Array (FPGA) in the Lattice ECP2 family. It combines a mid-density logic fabric with embedded memory and a broad I/O count in a compact 208-pin BFQFP surface-mount package for system-level integration.

Designed for embedded and high-performance control applications, this device delivers 12,000 logic elements, 1500 CLBs and approximately 0.226 Mbits of on-chip RAM, with a 131-pin I/O capability and a low-voltage core supply range of 1.14 V to 1.26 V.

Key Features

• Logic Capacity — 12,000 logic elements across 1500 CLBs to support moderately complex FPGA designs and system integration tasks.
• On-chip Memory — Total of 226,304 bits (approximately 0.226 Mbits) of embedded RAM for buffering, state storage and small data caches.
• I/O Density — 131 available I/Os suitable for multi‑lane interfaces, sensor buses and peripheral connections in a single device.
• Packaging and Mounting — 208-BFQFP package in a surface-mount form factor; supplier device package listed as 208-PQFP (28×28 mm).
• Power — Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system rails.
• Temperature and Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Configuration and System Support — Family-level configuration features include SPI boot flash interface, dual boot image support and boundary-scan capability (1149.1) to streamline development and in-field updates.
• RoHS Compliance — Device is RoHS compliant for environmentally conscious designs.

Typical Applications

• Communications and Protocol Bridging — Use the device’s logic density and 131 I/Os to implement protocol translation, interface bridging and mid-range packet processing functions.
• Embedded System Control — Implement control logic, state machines and peripheral aggregation for industrial and consumer embedded platforms within the commercial temperature range.
• Memory and Buffering Functions — On-chip RAM and configurable I/O support make it suitable for small buffering tasks, data alignment and front-end preprocessing for larger systems.
• DSP and Acceleration Tasks — Family-level sysDSP and DSP-friendly architecture enable implementation of moderate DSP acceleration and fixed-point compute blocks.

Unique Advantages

• Balanced Logic and I/O — 12,000 logic elements and 131 I/Os provide a practical balance for mid-range system designs without excess board-level components.
• Compact, Surface-Mount Packaging — 208-BFQFP surface-mount package enables integration into space-constrained PCBs while preserving high I/O count.
• Low-Voltage Core Compatibility — Narrow core supply range (1.14 V–1.26 V) supports modern low-voltage system architectures.
• Embedded Memory for On-Device Data Handling — Approximately 0.226 Mbits of on-chip RAM reduces external memory dependency for control-oriented buffering and scratch storage.
• Development and Field Update Support — Family configuration features such as SPI boot and dual-boot image support simplify deployment and in-field updates.
• Regulatory and Manufacturing Readiness — RoHS compliance and surface-mount form factor ease manufacturing and environmental compliance requirements.

Why Choose LFE2-12E-5Q208C?

The LFE2-12E-5Q208C targets designers who need a commercially graded, mid-density FPGA with a strong balance of logic, I/O and on-chip memory in a compact package. Its 12,000 logic elements, 1500 CLBs and 131 I/Os make it suitable for embedded controllers, protocol bridging and moderate DSP tasks where board space and system integration matter.

Choosing this device gives you a fabric with family-level configuration flexibility and on-chip resources to reduce external BOM complexity. It is well suited to teams seeking a scalable, commercially specified FPGA solution backed by the ECP2 family feature set.

If you would like a quote or additional procurement information for LFE2-12E-5Q208C, submit a request and our team will respond with pricing and availability details.