LFE2-12E-5F484I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA |
|---|---|
| Quantity | 659 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 297 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-5F484I – ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA
The LFE2-12E-5F484I is a field programmable gate array (FPGA) from Lattice Semiconductor, designed to deliver mid-range programmable logic capacity in a compact BGA package. It integrates 12,000 logic elements and on-chip memory to enable custom digital logic implementations within space-constrained systems.
With 297 user I/Os, a supply voltage range of 1.14 V to 1.26 V, and industrial-grade operation from -40 °C to 100 °C, this device is suited to applications that require substantial I/O count, embedded memory, and reliable operation across a wide temperature range.
Key Features
- Logic Capacity 12,000 logic elements to implement custom digital logic, state machines, and glue logic.
- Embedded Memory Approximately 0.226 Mbits (226,304 bits) of on-chip RAM for buffering, LUT-based storage, and small data tables.
- I/O 297 user I/O pins to support extensive peripheral interfacing and multi-channel signal connectivity.
- Power Narrow core supply range of 1.14 V to 1.26 V to match target system power rails.
- Package & Mounting 484-ball BGA in a 484-FPBGA (23 × 23) format; designed for surface-mount assembly in compact PCBs.
- Temperature & Grade Industrial-grade device with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant to meet standard environmental and manufacturing requirements.
Typical Applications
- Industrial Control and Automation Use the device where programmable logic, broad I/O counts, and industrial temperature operation are required for control and monitoring tasks.
- Communications and Networking Implement protocol bridging, interface logic, and custom packet processing with the available logic elements and I/O resources.
- Embedded System Glue Logic Integrate peripheral interfaces, bus arbitration, and custom timing logic to consolidate discrete components and reduce board complexity.
- Sensor and Data Aggregation Collect and pre-process data from multiple inputs using on-chip RAM for buffering and the FPGA fabric for custom processing pipelines.
Unique Advantages
- Substantial Logic Density: 12,000 logic elements provide the capacity to implement complex custom functions without external ASICs.
- High I/O Count: 297 user I/Os allow dense connectivity to sensors, transceivers, and peripherals, reducing the need for external multiplexers.
- Embedded On-Chip Memory: Approximately 0.226 Mbits of RAM supports buffering, small FIFO implementations, and lookup tables directly on-chip.
- Industrial Temperature Range: Rated from -40 °C to 100 °C for deployment in thermally demanding or outdoor environments.
- Compact BGA Package: 484-ball FPBGA (23 × 23) enables space-efficient PCB layouts while supporting high pin counts.
- RoHS Compliant: Meets common environmental standards for contemporary electronic manufacturing.
Why Choose LFE2-12E-5F484I?
The LFE2-12E-5F484I balances substantial logic resources, on-chip memory, and a high I/O count within a compact 484-ball BGA footprint, making it a practical choice for embedded systems that require programmable logic and extensive interfacing. Its industrial temperature rating and RoHS compliance support reliable deployment across a range of commercial and industrial applications.
This device is well suited for engineers and system designers looking to consolidate discrete logic functions, implement custom interfaces, or add programmable processing capability to devices without exceeding board area or thermal margins.
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