LFD2NX-40-9BG256C

IC FPGA 192 I/O 256CABGA
Part Description

Certus™-NX Field Programmable Gate Array (FPGA) IC 192 1548288 39000 256-LFBGA

Quantity 112 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O192Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9750Number of Logic Elements/Cells39000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1548288

Overview of LFD2NX-40-9BG256C – Certus™-NX Field Programmable Gate Array (FPGA) IC

The LFD2NX-40-9BG256C is a Certus™-NX family FPGA offered in a 256‑LFBGA surface-mount package. It integrates a configurable logic fabric with on-chip memory, dedicated DSP resources and a versatile programmable I/O matrix to support system-level integration in commercial applications.

Built for designs that require flexible hardware acceleration, multi‑standard I/O and advanced clocking, this device combines approximately 39,000 logic elements, approximately 1.55 Mbits of embedded memory and 192 I/O pins in a compact 256‑CABGA (14×14) footprint.

Key Features

  • Core Logic  Configurable logic fabric with approximately 39,000 logic elements for implementing custom logic, control and datapath functions.
  • Embedded Memory  Approximately 1.55 Mbits of on‑chip memory with sysMEM and large RAM support, including single, dual and pseudo‑dual port modes, memory cascading and RAM initialization/ROM operation.
  • DSP and Acceleration  sysDSP architecture features for dedicated signal processing and arithmetic functions as described in the Certus‑NX family documentation.
  • Programmable I/O and Interfaces (192 I/Os)  Programmable I/O cells and sysI/O buffer support a range of I/O standards, DDR memory interfaces, DQS grouping and DDR DLL calibrated DQS control; MIPI D‑PHY support is included in the family feature set.
  • Advanced Clocking  Global PLL, clock distribution network, clock dividers, dynamic clock select/control and DDRDLL capabilities provide flexible clock management options.
  • Analog & Peripherals  On‑chip ADCs, continuous time comparators and an internal junction temperature monitoring diode are available as part of the family feature set; an on‑chip oscillator and user I²C IP are also provided.
  • Configuration & Reliability  Enhanced configuration options including dual‑boot and multi‑boot image support, Single Event Upset (SEU) support and IEEE 1149.1‑compliant boundary scan testability.
  • Power, Package & Grade  Core voltage supply range 0.95 V to 1.05 V; supplied in a 256‑LFBGA (256‑CABGA 14×14) surface‑mount package; commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Signal Processing & Acceleration  Use the sysDSP resources and on‑chip memory to implement real‑time filters, transforms and custom hardware accelerators.
  • High‑speed Memory Interfaces  DDR memory support, DQS grouping and calibrated DQS control enable reliable interface logic for external memory subsystems.
  • Multi‑protocol I/O and Protocol Bridging  Programmable I/O cells and MIPI D‑PHY support facilitate integration of multiple serial and parallel interfaces in a single device.
  • System Integration & Prototyping  Flexible configuration options, boundary scan testability and dual/multi‑boot capability support development, system bring‑up and iterative firmware deployment.

Unique Advantages

  • Highly integrated logic and memory: Combining approximately 39,000 logic elements with ~1.55 Mbits of embedded memory reduces the need for external components and simplifies board design.
  • Flexible, protocol‑ready I/O: 192 programmable I/Os and family support for multiple I/O standards, DDR interfaces and MIPI D‑PHY enable broad connectivity choices.
  • Comprehensive clocking options: Global PLLs, clock distribution and DDRDLL support make meeting complex timing and synchronization requirements more straightforward.
  • On‑chip analog and system peripherals: Integrated ADCs, comparators and temperature monitoring provide system telemetry and analog interfacing without additional ICs.
  • Production‑ready package and compliance: 256‑LFBGA surface‑mount package, commercial temperature grade (0 °C to 85 °C) and RoHS compliance support mainstream product deployments.
  • Robust configuration and testability: Dual/multi‑boot support, SEU mitigation features and IEEE 1149.1 boundary scan simplify development, deployment and manufacturing test.

Why Choose LFD2NX-40-9BG256C?

The LFD2NX-40-9BG256C delivers a balanced combination of configurable logic capacity, embedded memory and a broad set of system features drawn from the Certus‑NX family. Its programmable I/O, DDR memory support and advanced clocking make it well suited for designs that need flexible interfacing and deterministic hardware acceleration while remaining within a commercial temperature range.

This device is aimed at engineers and teams developing commercial applications that require on‑chip DSP capability, versatile memory configurations and rich peripheral support in a compact 256‑LFBGA footprint. The combination of family features documented in the Certus‑NX datasheet and the device’s electrical and packaging specifications provides a clear platform for scalable system designs.

Request a quote or submit a quote to begin procurement for the LFD2NX-40-9BG256C Certus‑NX FPGA.

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