LFD2NX-40-9BG196C

IC FPGA CERTUS-NX 196BGA
Part Description

Certus™-NX Field Programmable Gate Array (FPGA) IC 150 1548288 39000 196-LFBGA

Quantity 454 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package196-CABGA (12x12)GradeCommercialOperating Temperature0°C – 85°C
Package / Case196-LFBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9750Number of Logic Elements/Cells39000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1548288

Overview of LFD2NX-40-9BG196C – Certus™-NX Field Programmable Gate Array (FPGA) IC 150 1548288 39000 196-LFBGA

The LFD2NX-40-9BG196C is a Certus™-NX field programmable gate array (FPGA) optimized for commercial embedded applications. It combines a substantial logic fabric with on-chip memory and a high I/O count to support custom digital logic, glue-logic integration, and moderate-density system control.

Key device attributes include 39,000 logic elements, approximately 1.55 Mbits of embedded memory, 150 I/Os, a compact 196-LFBGA package, and low-voltage core operation between 0.95 V and 1.05 V. The device is RoHS compliant and specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

  • Core Logic 9,750 logic blocks and 39,000 logic elements provide a flexible fabric for implementing custom logic functions and accelerating compute tasks.
  • Embedded Memory Approximately 1.55 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
  • I/O Density 150 general-purpose I/Os enable broad connectivity for peripherals, sensors, interfaces, and board-level integration.
  • Power Core supply range of 0.95 V to 1.05 V supports low-voltage operation for designs targeting reduced power consumption.
  • Package & Mounting 196-LFBGA package (supplier package 196-CABGA, 12×12) in a surface-mount form factor for compact PCB designs.
  • Temperature & Grade Commercial grade operation from 0 °C to 85 °C suitable for mainstream electronic products and embedded systems.
  • Regulatory RoHS compliant to support environmentally conscious product designs.

Typical Applications

  • Commercial Embedded Systems — Implement control logic, protocol handling, and interface glue in consumer and office equipment using the device's logic and I/O resources.
  • Prototyping and Development — Leverage the FPGA's programmable fabric and on-chip RAM for hardware validation, algorithm testing, and early system integration.
  • High-Density I/O Interface — Use the 150 I/Os to aggregate sensors, user interfaces, and peripheral buses in compact PCB layouts.
  • Custom Logic Acceleration — Offload specialized functions to FPGA logic elements to reduce external component count and central processing load.

Unique Advantages

  • Dense Logic Capacity: 39,000 logic elements enable substantial on-chip implementation of custom logic without immediate need for external ASICs.
  • On-Chip Memory: Approximately 1.55 Mbits of RAM reduce dependency on external memory for buffering and state retention, simplifying BOM and layout.
  • Generous I/O Count: 150 I/Os provide flexibility for varied interface requirements and simplify board-level integration of peripherals.
  • Compact, Surface-Mount Package: 196-LFBGA (196-CABGA, 12×12) supports space-constrained designs while maintaining thermal and routing characteristics suitable for surface-mount assembly.
  • Low-Voltage Core Operation: Core supply range of 0.95–1.05 V supports low-power design strategies and compatibility with modern power rails.
  • RoHS Compliant: Meets environmental requirements for mainstream electronic product manufacturing.

Why Choose LFD2NX-40-9BG196C?

The LFD2NX-40-9BG196C balances substantial logic and memory resources with a high I/O count and compact package, making it well suited for commercial embedded designs that require programmable customization and integration. Its combination of 39,000 logic elements, approximately 1.55 Mbits of on-chip RAM, and 150 I/Os enables consolidation of discrete functions and streamlined system designs.

This device is a practical choice for engineers and product teams building commercial electronic products and prototypes who need a programmable, RoHS-compliant FPGA in a surface-mount 196-LFBGA footprint and operating across a 0 °C to 85 °C temperature range.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery options for the LFD2NX-40-9BG196C. Our team can provide technical information and help integrate this FPGA into your next commercial embedded design.

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