LFD2NX-40-9BG196C
| Part Description |
Certus™-NX Field Programmable Gate Array (FPGA) IC 150 1548288 39000 196-LFBGA |
|---|---|
| Quantity | 454 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CABGA (12x12) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-LFBGA | Number of I/O | 150 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9750 | Number of Logic Elements/Cells | 39000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1548288 |
Overview of LFD2NX-40-9BG196C – Certus™-NX Field Programmable Gate Array (FPGA) IC 150 1548288 39000 196-LFBGA
The LFD2NX-40-9BG196C is a Certus™-NX field programmable gate array (FPGA) optimized for commercial embedded applications. It combines a substantial logic fabric with on-chip memory and a high I/O count to support custom digital logic, glue-logic integration, and moderate-density system control.
Key device attributes include 39,000 logic elements, approximately 1.55 Mbits of embedded memory, 150 I/Os, a compact 196-LFBGA package, and low-voltage core operation between 0.95 V and 1.05 V. The device is RoHS compliant and specified for commercial temperature operation from 0 °C to 85 °C.
Key Features
- Core Logic 9,750 logic blocks and 39,000 logic elements provide a flexible fabric for implementing custom logic functions and accelerating compute tasks.
- Embedded Memory Approximately 1.55 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
- I/O Density 150 general-purpose I/Os enable broad connectivity for peripherals, sensors, interfaces, and board-level integration.
- Power Core supply range of 0.95 V to 1.05 V supports low-voltage operation for designs targeting reduced power consumption.
- Package & Mounting 196-LFBGA package (supplier package 196-CABGA, 12×12) in a surface-mount form factor for compact PCB designs.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C suitable for mainstream electronic products and embedded systems.
- Regulatory RoHS compliant to support environmentally conscious product designs.
Typical Applications
- Commercial Embedded Systems — Implement control logic, protocol handling, and interface glue in consumer and office equipment using the device's logic and I/O resources.
- Prototyping and Development — Leverage the FPGA's programmable fabric and on-chip RAM for hardware validation, algorithm testing, and early system integration.
- High-Density I/O Interface — Use the 150 I/Os to aggregate sensors, user interfaces, and peripheral buses in compact PCB layouts.
- Custom Logic Acceleration — Offload specialized functions to FPGA logic elements to reduce external component count and central processing load.
Unique Advantages
- Dense Logic Capacity: 39,000 logic elements enable substantial on-chip implementation of custom logic without immediate need for external ASICs.
- On-Chip Memory: Approximately 1.55 Mbits of RAM reduce dependency on external memory for buffering and state retention, simplifying BOM and layout.
- Generous I/O Count: 150 I/Os provide flexibility for varied interface requirements and simplify board-level integration of peripherals.
- Compact, Surface-Mount Package: 196-LFBGA (196-CABGA, 12×12) supports space-constrained designs while maintaining thermal and routing characteristics suitable for surface-mount assembly.
- Low-Voltage Core Operation: Core supply range of 0.95–1.05 V supports low-power design strategies and compatibility with modern power rails.
- RoHS Compliant: Meets environmental requirements for mainstream electronic product manufacturing.
Why Choose LFD2NX-40-9BG196C?
The LFD2NX-40-9BG196C balances substantial logic and memory resources with a high I/O count and compact package, making it well suited for commercial embedded designs that require programmable customization and integration. Its combination of 39,000 logic elements, approximately 1.55 Mbits of on-chip RAM, and 150 I/Os enables consolidation of discrete functions and streamlined system designs.
This device is a practical choice for engineers and product teams building commercial electronic products and prototypes who need a programmable, RoHS-compliant FPGA in a surface-mount 196-LFBGA footprint and operating across a 0 °C to 85 °C temperature range.
Request a quote or submit an inquiry to obtain pricing, availability, and delivery options for the LFD2NX-40-9BG196C. Our team can provide technical information and help integrate this FPGA into your next commercial embedded design.