LFD2NX-40-8BG256I

IC FPGA 192 I/O 256CABGA
Part Description

Certus™-NX Field Programmable Gate Array (FPGA) IC 192 1548288 39000 256-LFBGA

Quantity 1,390 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O192Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9750Number of Logic Elements/Cells39000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1548288

Overview of LFD2NX-40-8BG256I – Certus™-NX Field Programmable Gate Array (FPGA) IC 192 1548288 39000 256-LFBGA

The LFD2NX-40-8BG256I is a Certus™-NX family FPGA manufactured by Lattice Semiconductor Corporation. It provides a mid-range programmable fabric with 39,000 logic elements, approximately 1.55 Mbits of embedded RAM, and 192 user I/Os in a 256-LFBGA package.

Designed for industrial-grade deployments, this device combines configurable logic, on-chip memory, and system-level building blocks described in the Certus‑NX family datasheet (routing, PLLs, sysMEM, sysDSP, programmable I/O, ADC, DDR support, configuration and SEU features) to address designs that require flexible I/O, embedded memory, and low-voltage core operation.

Key Features

  • Logic Capacity — 39,000 logic elements (cells) for mid-range programmable logic and custom acceleration.
  • Embedded Memory — Total on-chip RAM of 1,548,288 bits (approximately 1.55 Mbits) to support local buffering, FIFOs and memory-mapped logic.
  • I/O and Interfaces — 192 user I/O pins with programmable I/O cell features and DDR memory interface support as described in the Certus‑NX family documentation.
  • Clocking and Timing — Integrated clocking architecture including global PLLs, clock distribution network, clock dividers and dynamic clock control referenced in the family datasheet.
  • Signal Processing and Memory Blocks — Family-level sysDSP and sysMEM architectures provide dedicated DSP and large-memory block support for computational and buffering tasks.
  • Analog and System Features — Device-level features described in the family datasheet include analog interfaces (ADC), on-chip oscillator, boundary-scan testability and configuration options (dual/multi-boot image support).
  • Low-Voltage Core — Core supply in the range 0.95 V to 1.05 V for low-voltage system integration.
  • Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for industrial applications.
  • Package and Mounting — 256-LFBGA (supplier package: 256-CABGA 14×14), surface-mount package suitable for compact board designs.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Flexible I/O and industrial temperature rating support control, monitoring and automation systems requiring reliable programmable logic.
  • Edge Networking and Interfaces — Clocking structures, PLLs and documented DDR/memory interface support make the device applicable to communication interface bridging and protocol handling.
  • Sensor and Signal Processing — On-chip sysDSP and ADC elements described in the family documentation enable local signal conditioning and intermediate processing for sensors and instrumentation.
  • Embedded Memory and Buffering — Approximately 1.55 Mbits of embedded RAM supports buffering, packet storage or memory-mapped logic for mid-range embedded designs.

Unique Advantages

  • Mid-range, configurable logic density — 39,000 logic elements deliver a balance between capacity and cost for designs that require substantial but not top-tier logic resources.
  • Integrated memory and DSP building blocks — Approximately 1.55 Mbits of on-chip RAM plus sysDSP/sysMEM architectural elements (as described in the Certus‑NX family datasheet) reduce external memory dependence and simplify board-level design.
  • Flexible I/O complement — 192 user I/Os with programmable I/O cell features give designers the ability to adapt the device to a wide set of interface requirements.
  • Industrial operating range — Rated from -40 °C to 100 °C to meet thermal requirements of industrial deployments.
  • Compact board footprint — 256-LFBGA package (14×14 CABGA) enables dense PCB integration for space-constrained applications.
  • Low-voltage core operation — Core supply range of 0.95 V to 1.05 V supports low-power system architectures.

Why Choose LFD2NX-40-8BG256I?

The LFD2NX-40-8BG256I delivers a balanced combination of logic capacity, embedded memory, and a broad set of system-level features drawn from the Certus‑NX family architecture. Its industrial temperature rating, low-voltage core operation, and compact 256-LFBGA package make it suitable for mid-range industrial and embedded designs that require programmable logic, local memory, and flexible I/O.

Backed by the Certus‑NX family architecture described in the preliminary datasheet (clocking, sysMEM, sysDSP, programmable I/O, ADC, DDR support, configuration options and reliability features), this device is positioned for customers who need scalable, field-programmable logic in an industrial-grade form factor while minimizing external component count.

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