LFE2-12E-6F256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 1,308 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-6F256C – ECP2 FPGA, 12,000 logic elements, 256-BGA
The LFE2-12E-6F256C is a commercially graded ECP2 family Field Programmable Gate Array (FPGA) IC designed for applications that require programmable logic and substantial I/O density. It provides 12,000 logic elements and approximately 226 Kbits of on-chip RAM along with up to 193 I/O pins, enabling flexible implementation of custom logic and interfacing functions within a surface-mount 256-BGA package.
Operating from a core supply between 1.14 V and 1.26 V and rated for 0 °C to 85 °C, this device targets commercial embedded systems where integration density, configurable logic, and defined operating conditions are important.
Key Features
- Core Logic 12,000 logic elements for implementing custom digital logic, state machines, and glue logic within a single FPGA device.
- Embedded Memory Approximately 226 Kbits of on-chip RAM to support buffering, lookup tables, and small data storage needs without external memory.
- I/O Capacity Up to 193 I/O pins to support dense peripheral interfacing, parallel buses, and multi-channel signal routing.
- Power Supply Core voltage range of 1.14 V to 1.26 V for predictable power budgeting and integration with compatible power rails.
- Package and Mounting 256-ball FPGA package (256-FPBGA, 17×17) in a surface-mount form factor suitable for compact board layouts.
- Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial environment deployments.
- Regulatory RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Commercial Embedded Systems Implement custom control logic, protocol handling, or peripheral management in commercial devices that operate within standard temperature ranges.
- I/O-Intensive Interfaces Act as a programmable bridge for multiple interfaces or parallel buses, leveraging up to 193 I/Os for connectivity and signal routing.
- On-Board Processing and Glue Logic Replace discrete logic or small CPLDs with a single FPGA to consolidate glue logic, simple processing tasks, and state machines using available logic elements and embedded RAM.
- Prototyping and Development Platforms Provide a commercially graded FPGA option for evaluation boards and development systems where defined commercial operating conditions are acceptable.
Unique Advantages
- Significant Logic Capacity: 12,000 logic elements enable compact implementation of complex logic functions without multiple components.
- On-Chip Memory: Approximately 226 Kbits of embedded RAM reduces dependence on external memory for buffering and small data storage.
- High I/O Count: 193 available I/Os support dense interfacing requirements, minimizing the need for external I/O expanders.
- Compact Packaging: 256-FPBGA (17×17) surface-mount package supports high-density board designs while keeping component count low.
- Commercial Grade: Designed for commercial applications with an operating temperature range of 0 °C to 85 °C to match typical industry deployments.
- RoHS Compliant: Meets RoHS requirements for environmentally responsible manufacturing and assembly.
Why Choose LFE2-12E-6F256C?
The LFE2-12E-6F256C delivers a balanced combination of logic density, embedded memory, and high I/O count in a compact 256-BGA package, making it well suited for commercial embedded designs that require programmable logic and flexible interfacing. Its defined core voltage range and commercial operating temperature provide predictable integration into system power and thermal budgets.
This device is a practical choice for engineers and procurement teams seeking a single-chip solution to consolidate logic functions, implement interface bridges, or prototype commercial applications where on-chip resources and I/O density matter. The RoHS compliance and common package format also support streamlined manufacturing and assembly processes.
Request a quote or submit a purchase inquiry to receive pricing and availability for the LFE2-12E-6F256C FPGA. Our team can provide the next steps for ordering and lead-time information.

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