LFE2-12E-6F256I

The LFE2-12E-6F256I is an ECP2 family Field Programmable Gate Array (FPGA) designed for industrial applications requiring configurable digital logic and flexible I/O. It combines approximately 12,000 logic elements with a substantial I/O count and embedded memory to support custom logic, protocol implementation, and system integration tasks.

With a 256-ball BGA package, surface-mount mounting, and an industrial operating range, this device is suited to designs that demand compact board-level integration, low-voltage core operation, and RoHS compliance.

Key Features

• Core & Logic  Approximately 12,000 logic elements and around 1,500 logic blocks provide a configurable fabric for implementing custom digital functions and glue logic.
• Embedded Memory  Approximately 0.226 Mbits (226,304 bits) of on-chip RAM supports buffering, small lookup tables, and state storage for control and data-processing tasks.
• I/O Capacity  193 user I/Os enable dense external device interfacing, protocol conversion, and parallel or serial connectivity consolidation on a single device.
• Power  Core supply requirements range from 1.14 V to 1.26 V, enabling compatibility with low-voltage system designs and power-managed platforms.
• Package & Mounting  256-BGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount configuration supports compact board layouts and high-density routing.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Environmental Compliance  RoHS-compliant construction to meet environmental and regulatory requirements.

Typical Applications

• Custom I/O Systems  Use the 193 I/Os and programmable logic to implement tailored I/O expansion, signal conditioning, and protocol bridging without adding multiple fixed-function parts.
• Embedded Control  Leverage approximately 12,000 logic elements and on-chip RAM for implementing application-specific control logic and finite-state machines in industrial equipment.
• Protocol Conversion and Glue Logic  Consolidate interface translation and timing adaptation tasks into a single FPGA fabric to reduce board-level complexity.
• Compact Board Integration  The 256-BGA surface-mount package supports space-constrained designs that require robust logic and I/O capability in a small footprint.

Unique Advantages

• Highly configurable logic capacity: Approximately 12,000 logic elements enable implementation of complex custom logic and consolidation of multiple discrete functions into one device.
• High I/O density: 193 user I/Os reduce the need for external I/O expanders and simplify routing for multi-interface designs.
• Low-voltage core operation: Narrow supply range (1.14 V to 1.26 V) supports integration into modern low-voltage power architectures.
• Industrial temperature rating: Qualified for −40 °C to 100 °C operation, supporting deployment in harsh or outdoor environments where wider temperature tolerance is required.
• Compact package for board-level integration: 256-FPBGA (17×17) surface-mount package enables dense PCB layouts while maintaining robust electrical performance.
• RoHS compliant: Environmentally compliant construction suitable for regulated product lines.

Why Choose LFE2-12E-6F256I?

The LFE2-12E-6F256I delivers a balanced combination of logic capacity, I/O density, and industrial operating range for engineers building compact, rugged digital systems. Its ECP2 FPGA architecture and on-chip resources let designers consolidate custom logic, interface adaptation, and small data buffering into a single, surface-mount package.

This part is ideal for teams seeking a scalable, RoHS-compliant FPGA solution that fits into low-voltage, temperature-challenging environments while simplifying BOM and board layout. Specify LFE2-12E-6F256I when your design needs programmable logic density paired with broad I/O capability in an industrial-grade package.

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