LFE2-12E-6FN256C

The LFE2-12E-6FN256C is a commercial-grade ECP2 family FPGA from Lattice Semiconductor Corporation. It provides a mid-range programmable logic fabric with 12,000 logic elements and on-chip RAM, packaged in a compact 256‑BGA (256‑FPBGA, 17×17) surface-mount package.

Designed for commercial embedded applications, the device delivers a combination of programmable logic density, a high pin count, and low-voltage core operation to support a variety of custom logic, interface, and control functions.

Key Features

• Core Logic  12,000 logic elements provide mid-range programmable logic capacity for custom hardware functions and control logic.
• Logic Blocks  1,500 CLB-type logic blocks for structured mapping of logic resources.
• On‑Chip Memory  226,304 total RAM bits — approximately 0.226 Mbits of embedded memory for buffering, LUTs, and small data storage.
• I/O Count  193 user I/O pins to support diverse external interfaces and peripheral connections.
• Power Supply  Core supply voltage range of 1.14 V to 1.26 V for compatibility with modern low-voltage power domains.
• Package & Mounting  256‑BGA (supplier device package: 256‑FPBGA, 17×17), surface-mount package for compact board integration.
• Operating Range & Grade  Commercial temperature range of 0 °C to 85 °C; rated as commercial grade.
• Compliance  RoHS‑compliant material and manufacturing.

Typical Applications

• Commercial Embedded Systems  Implement custom control, protocol handling, and glue-logic in space-constrained commercial products.
• Communications Equipment  Use the FPGA’s programmable logic and 193 I/Os to implement interface bridging and custom packet processing functions.
• Prototyping and Development  Rapidly validate hardware concepts and iterate on custom logic designs using the device’s mid-range resource set.
• Custom I/O and Peripheral Control  Consolidate interface translation, timing control, and I/O expansion within a single programmable device.

Unique Advantages

• Mid‑range Logic Capacity: 12,000 logic elements provide a balance between resource density and cost for commercial designs.
• Structured Logic Blocks: 1,500 CLB-type blocks facilitate organized implementation of logic functions.
• Ample I/O Count: 193 I/Os reduce the need for external interface chips and simplify board-level connectivity.
• Compact BGA Package: 256‑BGA (256‑FPBGA, 17×17) enables high-density PCB layouts while maintaining a surface-mount footprint.
• Low‑Voltage Core: 1.14 V–1.26 V supply range aligns with contemporary power architectures for reduced core power consumption.
• Commercial Temperature Rating & RoHS Compliance: Suitable for standard commercial environments and manufactured to RoHS standards.

Why Choose LFE2-12E-6FN256C?

The LFE2-12E-6FN256C positions itself as a practical, mid-range FPGA choice for commercial embedded designs that require a solid balance of logic capacity, I/O density, and compact packaging. Its 12,000 logic elements, approximately 0.226 Mbits of on-chip RAM, and 193 I/Os make it well suited for projects that need custom logic, interface consolidation, or prototype validation in a commercial temperature envelope.

Manufactured by Lattice Semiconductor Corporation and offered in a 256‑BGA surface-mount package, this device provides a clear path for designers seeking scalable programmable logic in commercial products where board area, I/O count, and low-voltage operation are key considerations.

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