LFE2-12E-6F484I

The LFE2-12E-6F484I is an ECP2 family Field Programmable Gate Array (FPGA) designed for mid-density logic integration in industrial applications. It provides a balance of programmable logic capacity, embedded memory, and a high I/O count in a compact 484-ball BGA package.

With 12,000 logic elements, approximately 0.226 Mbits of on-chip RAM, and support for 297 I/Os, this device is suited for control, communications, and instrumentation designs that require industrial temperature range and a low-voltage core supply.

Key Features

• Core Logic 12,000 logic elements provide mid-density programmable logic resources for custom digital functions and glue-logic integration.
• Embedded Memory Approximately 226,304 bits of on-chip RAM for FIFOs, buffering, and small data storage needs.
• High I/O Count 297 I/Os to support multiple interfaces and parallel connections without external multiplexing.
• Power and Voltage Core supply range of 1.14 V to 1.26 V allowing integration into low-voltage system domains.
• Package and Mounting 484-BBGA package (supplier device package: 484-FPBGA, 23×23) optimized for surface-mount PCB assembly and dense board layouts.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Mounting Type Surface mount package for standard SMT assembly processes.
• RoHS Compliant Conforms to RoHS requirements for lead-free manufacturing and reduced environmental impact.

Typical Applications

• Industrial Control and Automation — Implement motor control logic, protocol bridging, and custom machine control functions within industrial temperature ranges.
• Communications Equipment — Support parallel interfaces, custom packet processing, and protocol adaptation where moderate logic density and many I/Os are required.
• Instrumentation and Test Equipment — Provide flexible logic for data aggregation, timing, and control of measurement subsystems.

Unique Advantages

• Mid-density Logic Capacity: 12,000 logic elements deliver the programmability needed for glue logic, protocol handling, and customized datapaths without overprovisioning.
• On-chip RAM for Local Storage: Approximately 226,304 bits of embedded memory reduce dependence on external RAM for small buffers and FIFOs.
• Extensive I/O Availability: 297 I/Os enable direct connection to multiple peripherals and buses, simplifying board-level design.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh environments and factory-floor applications.
• Compact BGA Footprint: 484-ball BGA (484-FPBGA, 23×23) balances pin count and board area for dense system designs.
• Low-voltage Core Compatibility: 1.14–1.26 V supply aligns with modern low-voltage system rails.

Why Choose LFE2-12E-6F484I?

The LFE2-12E-6F484I targets designs that need a reliable mid-range FPGA with substantial I/O capacity and embedded memory while operating across industrial temperatures. Its combination of 12,000 logic elements, roughly 0.226 Mbits of on-chip RAM, and 297 I/Os makes it well-suited for control, communications, and instrumentation projects where integration and board-level simplicity matter.

Manufactured in a compact 484-ball BGA and compliant with RoHS requirements, this device is a practical choice for engineers seeking a durable, programmable solution that aligns with low-voltage system domains and standard surface-mount assembly processes.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-12E-6F484I. Our team can provide lead-time and ordering information to help you move your design forward.