LFE2-12E-7F256C

The LFE2-12E-7F256C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a combination of programmable logic, on-chip RAM and substantial I/O in a compact 256-ball BGA package.

Key device characteristics include 12,000 logic elements, approximately 226,304 bits of on-chip RAM, 193 I/O pins, and a core voltage supply range of 1.14 V to 1.26 V. The device is supplied in a 256-FPBGA (17×17) package and specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  12,000 logic elements and 1,500 CLBs provide programmable resources for custom digital functions and moderate-density designs.
• Embedded Memory  Approximately 226,304 bits of on-chip RAM enable local data buffering and state storage within the FPGA fabric.
• I/O Count  193 I/O pins support extensive board-level interfacing for parallel and serial signal routing.
• Power  Core voltage supply range of 1.14 V to 1.26 V for low-voltage operation within supported system rails.
• Package  256-ball BGA in a 256-FPBGA (17×17) footprint to minimize PCB area while providing dense connectivity.
• Mounting and Grade  Surface-mount device specified for commercial grade operation (0 °C to 85 °C).
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital logic implementation  Use the device’s 12,000 logic elements and 1,500 CLBs to implement bespoke finite state machines, data paths, and control logic.
• On-board buffering and temporary storage  Approximately 226,304 bits of embedded RAM enable local buffering for data aggregation, packet queues, or temporary storage.
• High-pin-count interface designs  193 I/O pins allow integration with multiple peripherals, sensors, or parallel interfaces on a single PCB.

Unique Advantages

• Substantial programmable capacity: 12,000 logic elements combined with 1,500 CLBs enable integration of multiple digital functions into a single FPGA, reducing external glue logic.
• On-chip memory for local buffering: Approximately 226,304 bits of RAM allow designers to implement FIFOs, small buffers, and local storage without external memory.
• High I/O density: 193 I/O pins simplify board-level connectivity and reduce the need for external I/O expanders.
• Compact BGA footprint: The 256-FPBGA (17×17) package minimizes PCB area while preserving a high pin count for complex interconnects.
• Low-voltage core operation: 1.14 V to 1.26 V supply range supports low-voltage system architectures and power-conscious designs.
• Commercial availability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose LFE2-12E-7F256C?

The LFE2-12E-7F256C positions itself as a capable FPGA option for designers who need a balance of logic density, on-chip memory, and a high number of I/O in a compact package. Its combination of 12,000 logic elements, ~226,304 bits of embedded RAM, and 193 I/O pins makes it suitable for consolidating multiple digital functions and interfaces onto a single programmable device.

As a commercial-grade, RoHS-compliant device supplied in a 256-FPBGA (17×17) package with a low-voltage core range, this FPGA is appropriate for standard embedded and system-level designs that require moderate logic capacity and significant I/O integration.

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