LFE2-12E-7TN144C

IC FPGA 93 I/O 144TQFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP

Quantity 256 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O93Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFE2-12E-7TN144C – ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP

The LFE2-12E-7TN144C is a commercial-grade Field Programmable Gate Array (FPGA) IC in the ECP2 family, offering a balance of logic capacity, embedded memory and I/O in a 144-pin LQFP package. Focused on cost-sensitive and space-constrained designs, it provides a measurable set of on-chip resources for custom digital functions.

Key device characteristics include 12,000 logic elements, 226,304 bits of on-chip RAM, 93 user I/O pins, a 1.14 V to 1.26 V core supply range, surface-mount 144-LQFP packaging, and a commercial operating range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Core Logic Contains 12,000 logic elements to implement combinational and sequential digital logic for custom functions and moderate-complexity designs.
  • Embedded Memory Provides 226,304 bits of on-chip RAM (approximately 0.226 Mbits) to support buffering, FIFOs and small on-chip data storage.
  • Configurable I/O Offers 93 user I/O pins to interface with peripherals, sensors and other digital subsystems within the pin count available on the 144-LQFP package.
  • Power Core supply range is specified at 1.14 V to 1.26 V, enabling predictable power-supply design for the FPGA core.
  • Package & Mounting Supplied in a 144-LQFP (supplier package listed as 144-TQFP, 20×20) surface-mount package for compact PCB integration.
  • Operating Range & Grade Commercial-grade operation from 0 °C to 85 °C, suitable for standard commercial electronic applications.
  • Compliance RoHS compliant to support environmental and regulatory requirements for lead-free designs.

Typical Applications

  • Custom Digital Logic Prototyping — Implement moderate-complexity logic designs using up to 12,000 logic elements and on-chip RAM for simulation, validation and early-stage development.
  • Embedded Control and Glue Logic — Use available I/O and embedded memory to integrate control functions, protocol bridging and glue logic in compact, surface-mount designs.
  • Compact System Integration — The 144-LQFP package and 93 I/O pins make this FPGA suitable for space-constrained boards that require a moderate amount of reconfigurable logic and internal RAM.

Unique Advantages

  • Balanced Logic and Memory: 12,000 logic elements paired with 226,304 bits of on-chip RAM provide a practical balance for many mid-range FPGA tasks without external memory dependencies.
  • Ample I/O in a Compact Package: Ninety-three user I/O pins in a 144-LQFP surface-mount package allow flexible peripheral interfacing while keeping board footprint small.
  • Predictable Power Envelope: A defined core voltage range (1.14 V–1.26 V) simplifies power supply design and integration into commercial systems.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, aligning the device with standard commercial product deployments.
  • RoHS Compliant: Meets lead-free requirements, supporting environmentally conscious manufacturing and regulatory needs.

Why Choose LFE2-12E-7TN144C?

The LFE2-12E-7TN144C positions itself as a practical, commercially graded FPGA option for designers needing a moderate logic capacity, on-chip memory and a healthy complement of I/O in a compact surface-mount package. Its combination of 12,000 logic elements, approximately 0.226 Mbits of embedded RAM and 93 I/O pins supports a wide range of mid-range digital functions while simplifying board-level integration.

This device is well suited for teams and projects that require predictable electrical characteristics (1.14 V–1.26 V core supply), RoHS compliance and commercial-temperature operation. Its package and feature set provide a scalable, supportable building block within FPGA-equipped product lines.

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