LFE2-12E-7TN144C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP |
|---|---|
| Quantity | 256 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 93 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12E-7TN144C – ECP2 Field Programmable Gate Array (FPGA) IC 93 226304 12000 144-LQFP
The LFE2-12E-7TN144C is a commercial-grade Field Programmable Gate Array (FPGA) IC in the ECP2 family, offering a balance of logic capacity, embedded memory and I/O in a 144-pin LQFP package. Focused on cost-sensitive and space-constrained designs, it provides a measurable set of on-chip resources for custom digital functions.
Key device characteristics include 12,000 logic elements, 226,304 bits of on-chip RAM, 93 user I/O pins, a 1.14 V to 1.26 V core supply range, surface-mount 144-LQFP packaging, and a commercial operating range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core Logic Contains 12,000 logic elements to implement combinational and sequential digital logic for custom functions and moderate-complexity designs.
- Embedded Memory Provides 226,304 bits of on-chip RAM (approximately 0.226 Mbits) to support buffering, FIFOs and small on-chip data storage.
- Configurable I/O Offers 93 user I/O pins to interface with peripherals, sensors and other digital subsystems within the pin count available on the 144-LQFP package.
- Power Core supply range is specified at 1.14 V to 1.26 V, enabling predictable power-supply design for the FPGA core.
- Package & Mounting Supplied in a 144-LQFP (supplier package listed as 144-TQFP, 20×20) surface-mount package for compact PCB integration.
- Operating Range & Grade Commercial-grade operation from 0 °C to 85 °C, suitable for standard commercial electronic applications.
- Compliance RoHS compliant to support environmental and regulatory requirements for lead-free designs.
Typical Applications
- Custom Digital Logic Prototyping — Implement moderate-complexity logic designs using up to 12,000 logic elements and on-chip RAM for simulation, validation and early-stage development.
- Embedded Control and Glue Logic — Use available I/O and embedded memory to integrate control functions, protocol bridging and glue logic in compact, surface-mount designs.
- Compact System Integration — The 144-LQFP package and 93 I/O pins make this FPGA suitable for space-constrained boards that require a moderate amount of reconfigurable logic and internal RAM.
Unique Advantages
- Balanced Logic and Memory: 12,000 logic elements paired with 226,304 bits of on-chip RAM provide a practical balance for many mid-range FPGA tasks without external memory dependencies.
- Ample I/O in a Compact Package: Ninety-three user I/O pins in a 144-LQFP surface-mount package allow flexible peripheral interfacing while keeping board footprint small.
- Predictable Power Envelope: A defined core voltage range (1.14 V–1.26 V) simplifies power supply design and integration into commercial systems.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, aligning the device with standard commercial product deployments.
- RoHS Compliant: Meets lead-free requirements, supporting environmentally conscious manufacturing and regulatory needs.
Why Choose LFE2-12E-7TN144C?
The LFE2-12E-7TN144C positions itself as a practical, commercially graded FPGA option for designers needing a moderate logic capacity, on-chip memory and a healthy complement of I/O in a compact surface-mount package. Its combination of 12,000 logic elements, approximately 0.226 Mbits of embedded RAM and 93 I/O pins supports a wide range of mid-range digital functions while simplifying board-level integration.
This device is well suited for teams and projects that require predictable electrical characteristics (1.14 V–1.26 V core supply), RoHS compliance and commercial-temperature operation. Its package and feature set provide a scalable, supportable building block within FPGA-equipped product lines.
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