LFE2-12SE-5F484I

The LFE2-12SE-5F484I is an ECP2 Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package. It provides reconfigurable logic resources, on-chip memory, and a high I/O count tailored for industrial-grade designs.

With approximately 12,000 logic elements, roughly 0.226 Mbits of embedded RAM and 297 I/Os, this device targets applications that require moderate logic capacity, significant I/O connectivity, and operation across an industrial temperature range.

Key Features

• Core Logic Approximately 12,000 logic elements to implement custom digital logic and control functions.
• Embedded Memory Approximately 226,304 bits (≈0.226 Mbits) of on-chip RAM for data buffering, FIFOs, and small LUT-based memory structures.
• I/O Density 297 I/O pins to support multiple interfaces, parallel buses, and broad peripheral connectivity.
• Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V for the FPGA core domain.
• Package 484-BBGA / 484-FPBGA (23×23) supplier device package offering a compact footprint with high pin count.
• Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance RoHS-compliant construction to meet common regulatory and manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Implement real-time control logic, interface aggregation, and protocol bridging within factory and process equipment operating across wide temperatures.
• Communications and Interface Processing — Provide custom packet handling, parallel-to-serial bridging, and glue logic for equipment requiring many I/Os.
• Embedded Systems — Integrate custom accelerators, state machines, and peripheral interfaces in compact, low-voltage systems.

Unique Advantages

• Moderate Logic Density: Approximately 12,000 logic elements enable substantial custom logic without excess complexity.
• High I/O Count: 297 I/Os support multiple external interfaces and high pin-density system designs.
• Compact High-Pin Package: 484-BBGA (484-FPBGA, 23×23) balances board space and connectivity for dense assemblies.
• Industrial Temperature Capability: −40 °C to 100 °C rating supports deployment in harsh or variable environments.
• Low-Voltage Core Operation: 1.14 V to 1.26 V supply minimizes core power while meeting FPGA fabric requirements.
• RoHS Compliant: Designed to meet environmental compliance expectations for manufacturing and shipping.

Why Choose LFE2-12SE-5F484I?

The LFE2-12SE-5F484I delivers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 484-ball BGA package. Its industrial temperature rating and low-voltage core operation make it suitable for a range of industrial and embedded FPGA designs that require reliable, reconfigurable logic and extensive external connectivity.

Engineers selecting this FPGA will gain a mid-density, industrial-grade option that supports scalable designs, simplifies board-level integration through a high pin count, and adheres to RoHS requirements for manufacturing consistency.

Request a quote or submit your procurement details today to get pricing and availability for the LFE2-12SE-5F484I.