LFE2-12SE-5FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA |
|---|---|
| Quantity | 675 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 297 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-5FN484C – ECP2 Field Programmable Gate Array (FPGA), 12,000 Logic Elements, 484-BBGA
The LFE2-12SE-5FN484C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation’s ECP2 family. It provides 12,000 logic elements and on-chip RAM to implement mid-range programmable logic in commercial embedded designs.
With a 1.14 V to 1.26 V core supply range, 297 user I/Os, and a 484-ball BGA package, this device is aimed at commercial applications that require a balance of integration, I/O capacity, and compact surface-mount packaging.
Key Features
- Core Logic 12,000 logic elements for implementing combinational and sequential logic functions in mid-range designs.
- On-Chip Memory Total on-chip RAM of 226,304 bits (approximately 0.226 Mbits) to support embedded buffering and state storage.
- I/O Capacity 297 user I/Os provide a high pin count for interfacing to peripherals, sensors, and system buses.
- Power Core supply voltage ranges from 1.14 V to 1.26 V to match target system power domains and enable consistent core operation.
- Package & Mounting 484-ball BGA (supplier package: 484-FPBGA, 23 × 23) in a surface-mount form factor for compact PCB integration.
- Operating Conditions Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.
Typical Applications
- Commercial Embedded Systems Implement mid-range control and logic functions where up to 12,000 logic elements and on-chip RAM are required.
- High‑Pin‑Count I/O Interfaces Use the 297 I/Os for designs that require extensive peripheral connectivity or multiple bus interfaces.
- Compact Surface‑Mount Designs The 484-BBGA package and surface-mount mounting simplify integration into space-constrained PCBs.
Unique Advantages
- Balanced Logic and Memory: 12,000 logic elements combined with approximately 0.226 Mbits of on-chip RAM support a wide range of mid-range logic and buffering needs without immediate reliance on external memory.
- High I/O Count: 297 user I/Os enable dense peripheral and bus connections, reducing the need for external multiplexing in many designs.
- Compact, Headerless Packaging: 484-ball BGA (23 × 23) keeps board footprint compact while providing the necessary ball count for complex designs.
- Commercial Temperature and Compliance: Commercial-grade operation from 0 °C to 85 °C with RoHS compliance supports standard manufacturing and deployment requirements.
- Defined Core Voltage Range: A specified core supply range of 1.14 V to 1.26 V supports consistent power planning during system design.
Why Choose LFE2-12SE-5FN484C?
The LFE2-12SE-5FN484C positions itself as a practical choice for engineers building commercial embedded systems that need a mid-range FPGA with substantial I/O and modest on-chip memory. Its 12,000 logic elements, nearly 0.226 Mbits of embedded RAM, and 297 I/Os make it suitable for integrating control logic, protocol bridging, and high‑pin‑count interfaces within a compact surface‑mount package.
Designed and supplied by Lattice Semiconductor Corporation, this commercial-grade device offers consistent electrical and thermal operating points for designs operating between 0 °C and 85 °C and supports RoHS-compliant manufacturing. It is appropriate for teams seeking a scalable, mid-capacity FPGA option from the ECP2 family for a wide range of commercial applications.
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