LFE2-12SE-5FN256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 448 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-5FN256C – ECP2 Field Programmable Gate Array (FPGA), 12,000 logic elements, 256-BGA
The LFE2-12SE-5FN256C is an ECP2-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a mid-range programmable logic resource set with measurable on-chip RAM, abundant I/O and a compact BGA package targeted at commercial electronic designs.
Key attributes include 12,000 logic elements, approximately 0.226 Mbits of embedded RAM, 193 I/O signals and a 256-ball BGA surface-mount package. The device is specified for commercial temperature operation (0 °C to 85 °C) and supports a core supply range of 1.14 V to 1.26 V.
Key Features
- Core Logic 12,000 logic elements and 1,500 logic blocks provide programmable capacity for glue logic, custom datapaths and medium-complexity state machines.
- On‑Chip Memory Approximately 0.226 Mbits (226,304 bits) of embedded RAM for FIFOs, buffering and small data storage without external memory.
- I/O Density 193 user I/O pins suitable for multiple parallel interfaces, sensor connections and control signals in a single device.
- Power Core supply voltage specified at 1.14 V to 1.26 V to align with system power-rail design and power budgeting.
- Package & Mounting 256-ball BGA (supplier package: 256-FPBGA, 17 × 17 mm) in a surface-mount format for high-density PCB implementations.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C for use in general-purpose commercial electronics.
- Environmental Compliance RoHS compliant to support environmentally conscious manufacturing processes.
Typical Applications
- Embedded Systems Implement custom control logic, protocol handling and interface bridging using on-chip logic and RAM.
- Communications & Connectivity Support multiple parallel or serial interfaces with the device’s high I/O count and programmable logic resources.
- Consumer & Commercial Electronics Integrate user-interface control, signal conditioning and peripheral management in compact BGA form factors.
- Prototyping and Evaluation Evaluate mid-range programmable designs and validate IP with a commercially graded ECP2 FPGA.
Unique Advantages
- Substantial Logic Capacity: 12,000 logic elements enable consolidation of multiple discrete functions into a single FPGA, reducing BOM and board complexity.
- On‑Chip Memory for Buffering: Approximately 0.226 Mbits of embedded RAM supports local buffering and small data structures without external memory.
- High I/O Count: 193 I/O pins allow direct interfacing to a wide range of peripherals and sensors without extensive external multiplexing.
- Compact, High‑Density Package: 256-BGA (17 × 17 mm) lets designers achieve high integration in space-constrained PCBs.
- Commercial Temperature Range: Rated 0 °C to 85 °C to match common commercial product requirements and deployment scenarios.
- RoHS Compliant: Facilitates manufacturing and compliance with environmental regulations.
Why Choose LFE2-12SE-5FN256C?
The LFE2-12SE-5FN256C positions itself as a commercially graded, mid-density FPGA option within the ECP2 family from Lattice Semiconductor Corporation. It combines 12,000 logic elements, substantial on-chip RAM and a high I/O count in a compact 256-BGA package, making it suitable for commercial embedded designs that require integrated programmable logic and interface consolidation.
Designers seeking a balance of logic capacity, on-chip memory and I/O in a surface-mount BGA form factor will find this device appropriate for prototyping and production of commercial electronic products, with RoHS compliance and defined supply and temperature specifications for predictable integration.
Request a quote or submit an inquiry to purchase the LFE2-12SE-5FN256C and get pricing and availability information for your project needs.

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