LFE2-12SE-5FN256C

IC FPGA 193 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA

Quantity 448 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O193Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFE2-12SE-5FN256C – ECP2 Field Programmable Gate Array (FPGA), 12,000 logic elements, 256-BGA

The LFE2-12SE-5FN256C is an ECP2-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a mid-range programmable logic resource set with measurable on-chip RAM, abundant I/O and a compact BGA package targeted at commercial electronic designs.

Key attributes include 12,000 logic elements, approximately 0.226 Mbits of embedded RAM, 193 I/O signals and a 256-ball BGA surface-mount package. The device is specified for commercial temperature operation (0 °C to 85 °C) and supports a core supply range of 1.14 V to 1.26 V.

Key Features

  • Core Logic 12,000 logic elements and 1,500 logic blocks provide programmable capacity for glue logic, custom datapaths and medium-complexity state machines.
  • On‑Chip Memory Approximately 0.226 Mbits (226,304 bits) of embedded RAM for FIFOs, buffering and small data storage without external memory.
  • I/O Density 193 user I/O pins suitable for multiple parallel interfaces, sensor connections and control signals in a single device.
  • Power Core supply voltage specified at 1.14 V to 1.26 V to align with system power-rail design and power budgeting.
  • Package & Mounting 256-ball BGA (supplier package: 256-FPBGA, 17 × 17 mm) in a surface-mount format for high-density PCB implementations.
  • Temperature & Grade Commercial grade operation from 0 °C to 85 °C for use in general-purpose commercial electronics.
  • Environmental Compliance RoHS compliant to support environmentally conscious manufacturing processes.

Typical Applications

  • Embedded Systems Implement custom control logic, protocol handling and interface bridging using on-chip logic and RAM.
  • Communications & Connectivity Support multiple parallel or serial interfaces with the device’s high I/O count and programmable logic resources.
  • Consumer & Commercial Electronics Integrate user-interface control, signal conditioning and peripheral management in compact BGA form factors.
  • Prototyping and Evaluation Evaluate mid-range programmable designs and validate IP with a commercially graded ECP2 FPGA.

Unique Advantages

  • Substantial Logic Capacity: 12,000 logic elements enable consolidation of multiple discrete functions into a single FPGA, reducing BOM and board complexity.
  • On‑Chip Memory for Buffering: Approximately 0.226 Mbits of embedded RAM supports local buffering and small data structures without external memory.
  • High I/O Count: 193 I/O pins allow direct interfacing to a wide range of peripherals and sensors without extensive external multiplexing.
  • Compact, High‑Density Package: 256-BGA (17 × 17 mm) lets designers achieve high integration in space-constrained PCBs.
  • Commercial Temperature Range: Rated 0 °C to 85 °C to match common commercial product requirements and deployment scenarios.
  • RoHS Compliant: Facilitates manufacturing and compliance with environmental regulations.

Why Choose LFE2-12SE-5FN256C?

The LFE2-12SE-5FN256C positions itself as a commercially graded, mid-density FPGA option within the ECP2 family from Lattice Semiconductor Corporation. It combines 12,000 logic elements, substantial on-chip RAM and a high I/O count in a compact 256-BGA package, making it suitable for commercial embedded designs that require integrated programmable logic and interface consolidation.

Designers seeking a balance of logic capacity, on-chip memory and I/O in a surface-mount BGA form factor will find this device appropriate for prototyping and production of commercial electronic products, with RoHS compliance and defined supply and temperature specifications for predictable integration.

Request a quote or submit an inquiry to purchase the LFE2-12SE-5FN256C and get pricing and availability information for your project needs.

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