LFE2-12SE-7FN256C

The LFE2-12SE-7FN256C is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, offering a balance of programmable logic capacity, embedded memory, and I/O density in a compact BGA package. Its combination of 12,000 logic elements, approximately 0.226 Mbits of embedded memory, and up to 193 I/Os makes it suitable for commercial applications requiring customizable digital logic and I/O integration.

Designed for surface-mount PCB assembly and commercial-temperature operation, this device provides a configurable platform for consolidating logic functions and adapting designs in the field while maintaining RoHS compliance.

Key Features

• Core Logic — 12,000 logic elements for implementing user-defined digital logic, state machines, and glue-logic integration.
• Embedded Memory — Approximately 0.226 Mbits of on-chip RAM to support buffers, FIFOs, and small data tables for deterministic, low-latency storage.
• I/O Density — Up to 193 configurable I/O pins to interface with peripherals, sensors, and external logic.
• Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V to support modern low-voltage system designs.
• Package & Mounting — 256-BGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for space-efficient board layouts.
• Operating Conditions — Commercial-grade temperature range from 0 °C to 85 °C for typical commercial electronics environments.
• Regulatory — RoHS compliant, supporting environmental and manufacturing requirements for lead-free assembly.

Typical Applications

• Programmable Logic Integration — Implement custom glue logic, protocol bridging, and application-specific state machines using the device’s 12,000 logic elements and embedded RAM.
• I/O Expansion and Interface — Use the high I/O count (up to 193) to aggregate and translate signals between multiple peripherals or subsystems.
• Embedded Control Functions — Deploy small control and sequencing functions that benefit from on-chip memory and reconfigurable logic in commercial electronic products.

Unique Advantages

• Balanced Logic and Memory — 12,000 logic elements paired with embedded RAM provides the resources needed to implement moderate-complexity designs without external memory.
• High I/O Count — Up to 193 I/Os reduce the need for external bus expanders, simplifying board design and lowering bill of materials.
• Compact, Surface-Mount Package — The 256-FPBGA (17×17) package offers a high pin-count in a space-efficient footprint for dense PCB layouts.
• Low Core Voltage — Operation at 1.14 V to 1.26 V aligns with low-voltage system architectures and can help reduce overall system power.
• Commercial Temperature Rating — Rated for 0 °C to 85 °C, suitable for standard commercial electronics deployments.
• RoHS Compliance — Supports lead-free manufacturing and regulatory requirements for environmentally conscious production.

Why Choose LFE2-12SE-7FN256C?

The LFE2-12SE-7FN256C provides a practical mix of programmable logic capacity, on-chip memory, and extensive I/O in a compact 256-BGA surface-mount package. Its electrical and environmental specifications make it a fit for commercial electronic designs that require field-programmable flexibility, I/O consolidation, and a reduced component count.

This device suits engineers and design teams looking to implement customizable logic functions, interface numerous peripherals, or prototype mid-complexity digital systems with a single, RoHS-compliant FPGA offering.

Request a quote or submit an inquiry for LFE2-12SE-7FN256C today to discuss pricing and availability for your project needs.