LFE2-12SE-7F256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 354 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-7F256C – ECP2 Field Programmable Gate Array (FPGA) IC, 256-BGA
The LFE2-12SE-7F256C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor presented in a 256-ball fpBGA (17 × 17 mm) package. It provides a mid-range integration point with 12,000 logic elements, substantial on-chip RAM and a high pin-count I/O complement for compact system designs.
This device is suited to applications that require moderate logic density, flexible I/O and embedded memory in a compact, surface-mount BGA footprint. Key value comes from its combination of configurable logic capacity, nearly quarter-megabit of embedded RAM and broad I/O availability while operating from a low core voltage.
Key Features
- Logic Capacity — 12,000 logic elements organized across 1,500 CLBs (configurable logic blocks), enabling mid-density FPGA implementations.
- Embedded Memory — Approximately 0.226 Mbits (226,304 bits) of on-chip RAM for data buffering, state storage and small embedded memories.
- I/O Resources — 193 user I/Os to support wide peripheral connectivity and multi-channel interfaces from a single device.
- Package & Mounting — 256-ball fpBGA (17 × 17 mm) package, surface-mountable for compact board-level integration.
- Power — Core supply range of 1.14 V to 1.26 V to meet system power-rail requirements for the ECP2 family architecture.
- Operating Range — Commercial-grade operation from 0 °C to 85 °C for standard ambient environments.
- Compliance — RoHS compliant for environmental and manufacturing requirements.
- Family Capabilities — As part of the Lattice ECP2 family, the platform supports advanced DSP and memory resources and a flexible sysI/O buffer architecture at the family level (see manufacturer datasheet for family-level features).
Typical Applications
- Data and Control Interfaces — Use the device to implement multi-channel I/O bridging, protocol adaptation or glue logic where significant I/O count and reconfigurability are required.
- Embedded Signal Processing — Leverage the device’s logic capacity and on-chip RAM for moderate DSP tasks, filtering and algorithm acceleration in compact systems.
- System Integration — Integrate peripheral timing, bus arbitration and custom logic functions to reduce BOM and consolidate discrete components onto a single FPGA.
- Prototyping and Development — Ideal for engineering prototypes and production designs that target a commercial temperature range and require a BGA package with high I/O density.
Unique Advantages
- Balanced Logic and Memory: Twelve thousand logic elements paired with approximately 0.226 Mbits of on-chip RAM accommodate a wide range of mid-density designs without external memory for smaller datasets.
- High I/O Count in a Compact Package: 193 I/Os in a 17 × 17 mm 256-ball fpBGA enable dense connectivity while preserving board area.
- Low-Voltage Core: Narrow core supply range (1.14–1.26 V) simplifies power-rail planning and supports efficient board-level power design.
- RoHS Compliant: Meets common environmental standards for modern electronic manufacturing.
- Commercial Temperature Suitability: Rated 0 °C to 85 °C for a wide range of consumer and general-purpose industrial electronics.
Why Choose LFE2-12SE-7F256C?
The LFE2-12SE-7F256C offers a practical balance of logic capacity, embedded memory and I/O connectivity in a compact 256-BGA package. It is aimed at designers who need a reconfigurable mid-range FPGA that integrates multiple subsystems onto a single device while maintaining a small PCB footprint and RoHS compliance.
Customers building communication peripherals, embedded controllers, or prototype platforms will find this device a flexible option that aligns performance and integration with commercial-grade temperature and low-voltage core requirements. Its family-level architecture provides additional capabilities for DSP and flexible I/O that can be leveraged as part of system-level design planning.
If you would like pricing, availability or a formal quote for the LFE2-12SE-7F256C, please request a quote or submit an inquiry and include your target quantities and delivery requirements.