LFE2-12SE-6T144I

The LFE2-12SE-6T144I is an ECP2 Field Programmable Gate Array (FPGA) IC offering 12,000 logic elements and 1,500 configurable logic blocks (CLBs). Built for surface-mount deployment in a 144-LQFP / 144-TQFP (20×20) package, this industrial-grade FPGA combines on-chip memory, a broad I/O complement, and a low-voltage core for embedded and industrial designs.

Key Features

• FPGA Core  ECP2 architecture with 1,500 CLBs and 12,000 logic elements to implement custom digital logic and control functions.
• Embedded Memory  Total on-chip RAM of 226,304 bits (approximately 0.226 Mbits) for data buffering, state storage, and small FIFO requirements.
• I/O Capacity  93 general-purpose I/O pins to interface with peripherals, sensors, and external logic devices.
• Power  Core voltage supply range of 1.14 V to 1.26 V to support low-voltage system designs.
• Package & Mounting  144-LQFP package (supplier device package: 144-TQFP, 20×20) with surface-mount mounting type for standard PCB assembly flows.
• Industrial Temperature & Compliance  Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant for environmental regulatory requirements.

Typical Applications

• Industrial Control  Use the FPGA’s 93 I/O and industrial temperature range to implement control logic, real-time I/O aggregation, and protocol bridging in factory automation equipment.
• Embedded Processing  Leverage 12,000 logic elements and on-chip RAM for custom data-paths, hardware accelerators, and glue logic in embedded systems.
• Communications and Interface Bridging  Deploy programmable I/O and logic resources to implement protocol adapters, serial/parallel interfaces, or timing-aware logic in communications hardware.

Unique Advantages

• Substantial logic capacity: 12,000 logic elements and 1,500 CLBs provide headroom for medium-complexity designs without external glue logic.
• On-chip memory for buffering: Approximately 0.226 Mbits of embedded RAM supports local data storage and small FIFOs, reducing external memory needs.
• Generous I/O count: 93 I/O pins allow flexible interfacing to sensors, actuators, peripherals, and external devices.
• Industrial readiness: Rated for −40 °C to 100 °C and supplied as an industrial-grade component for deployed systems operating across wide temperature ranges.
• Standard surface-mount package: 144-LQFP / 144-TQFP (20×20) package fits common PCB assembly processes and prototyping workflows.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing and deployment.

Why Choose LFE2-12SE-6T144I?

The LFE2-12SE-6T144I positions itself as a practical, industrial-grade FPGA option that balances logic capacity, embedded memory, and a robust I/O set in a standard 144-pin LQFP package. Its low-voltage core and on-chip resources make it suitable for designers needing programmable hardware acceleration, interface logic, or custom control implementations within constrained board space.

This device is well suited to engineering teams developing medium-complexity programmable logic solutions where industrial temperature range, RoHS compliance, and a manageable package footprint are required for long-term deployment and integration.

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