LFE2-20SE-5QN208I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP |
|---|---|
| Quantity | 928 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Not For New Designs |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 131 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-5QN208I – ECP2 Field Programmable Gate Array (FPGA) IC, 208-BFQFP
The LFE2-20SE-5QN208I is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It provides a balanced mix of programmable logic capacity, on-chip memory, and I/O count in a 208-BFQFP surface-mount package.
With industrial temperature grading and a low-voltage core supply range, this device targets systems requiring reliable programmable logic in demanding environments.
Key Features
- Core Logic Approximately 21,000 logic elements to implement medium-complexity custom logic and control functions.
- Embedded Memory Approximately 0.283 Mbits (282,624 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
- I/O Density 131 general-purpose I/O pins to support multiple interfaces and signal connections.
- Power Core voltage supply range of 1.14 V to 1.26 V to match common low-voltage FPGA power rails.
- Package and Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28 mm) in a surface-mount form factor for PCB integration.
- Temperature and Grade Industrial-grade device qualified for operation from -40 °C to 100 °C.
- Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.
Typical Applications
- Industrial control systems Use the FPGA’s logic capacity and industrial temperature range to implement control, sequencing, and interfacing functions in factory and process equipment.
- Embedded programmable logic Deploy as a configurable logic engine for embedded designs that require custom timing, protocol handling, or glue logic with 131 I/Os.
- Communication and I/O consolidation Leverage on-chip RAM and abundant I/O to implement buffering, protocol bridging, or I/O expansion in communication modules and gateways.
Unique Advantages
- Industrial-grade thermal tolerance: Rated for -40 °C to 100 °C operation to support deployment in harsh environments.
- Substantial logic capacity: Approximately 21,000 logic elements enable implementation of complex control and interfacing functions without external ASICs.
- Significant on-chip memory: Approximately 0.283 Mbits of embedded RAM for local buffering and small data structures, reducing external memory needs.
- High I/O count: 131 I/Os provide flexibility for connecting sensors, actuators, and peripheral interfaces.
- Compact surface-mount package: 208-BFQFP (208-PQFP, 28×28 mm) eases PCB layout and supports volume manufacturing.
- Low-voltage core operation: 1.14–1.26 V supply range aligns with modern low-voltage system rails to help manage power budgets.
Why Choose LFE2-20SE-5QN208I?
The LFE2-20SE-5QN208I positions itself as a reliable, industrial-grade FPGA option offering a balanced combination of logic density, embedded RAM, and I/O capacity in a compact surface-mount package. Its operating temperature range and RoHS compliance make it suitable for industrial deployments where environmental tolerance and regulatory compliance matter.
This device is well suited for engineers designing mid-level programmable logic solutions—where integration, predictable thermal performance, and a moderate on-chip memory footprint deliver long-term value and design flexibility backed by Lattice Semiconductor Corporation.
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